Standard Cell Layout Gridline Alignment for IC Routing
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Solution Overview
Problem
As semiconductor integrated circuits (ICs) become smaller and more complex, the resistance of conductive lines within them affects operating voltages and overall performance, necessitating improved layout designs for efficient conductive structure formation and routing.
Innovation Solution
The method involves generating standard cell layout designs with specific conductive feature layout patterns that overlap gridlines, allowing for the creation of additional routing resources by aligning cut feature layout patterns with gridlines, thereby optimizing conductive structure formation and utilization without violating via landing spot design rules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If IC size is reduced and complexity is increased, then device functionality is improved, but conductive line resistance increases affecting operating voltage and performance
Solution Approach 1:
The patent introduces cut features that extend conductive structures into the vertical dimension and create additional routing layers. By stacking conductive structures across multiple metal levels (M1, M2, M3, etc.) and using cut features to connect them, the design adds dimensional complexity that provides alternative current paths, effectively reducing the impact of resistance in individual conductive lines while maintaining miniaturization.
2Productivity
If standard cell layout designs are optimized for routing efficiency, then additional routing resources are created, but via landing spot design rules may be violated
Solution Approach 1:
The patent applies different layout strategies to different regions of the standard cell. Cut features are strategically positioned at specific locations (e.g., at cell boundaries or at points where conductive structures naturally intersect) to provide routing resources only where needed, while maintaining clear via landing spots in critical areas. This localized optimization allows enhanced routing efficiency without compromising manufacturing precision in via formation regions.
Solution Approach 2:
The conductive structures are segmented into multiple discrete segments across different metal levels, connected by vias at strategically chosen locations. The cut features create segmented routing paths that can be independently optimized, allowing the design to provide additional routing resources while maintaining proper via landing spot spacing and alignment in each segment.
3Area of stationary object
If conductive structure formation is optimized for density, then IC size is reduced, but routing flexibility is limited
Solution Approach 1:
The patent implements a nested hierarchy of conductive structures where cut features are embedded within the standard cell layout, and multiple metal levels are stacked within the same footprint. The cut features nest additional routing paths within the existing conductive structure framework, allowing the design to maintain high density while providing flexible routing options through the nested multi-layer architecture.
Data Source
AI summary
A method of forming an integrated circuit includes generating a first and a second standard cell layout design, generating a first set of cut feature layout patterns extending in a first direction, and manufacturing the integrated circuit based on the first or second standard cell layout design. Generating the first standard cell layout design includes generating a first set of conductive feature layout patterns extending in the first direction, and overlapping a first set of gridlines extending in the first direction. Generating the second standard cell layout design includes generating a second set of conductive feature layout patterns extending in the first direction and overlapping a second set of gridlines extending in the first direction. A side of a first cut feature layout pattern extending in the first direction is aligned with a first gridline of the first or second set of gridlines.