Standard Cell Layout With Uniform Height and Variable Width
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Solution Overview
Problem
The use of standard cells with different cell heights in integrated circuit layouts leads to irregular patterns, waste of space, and reduced design flexibility, as well as increased power loss due to extended metal interconnections, limiting the efficiency of the automated layout process.
Innovation Solution
The design of standard cells with a same cell height but different active region widths, incorporating specific relationships between gate line lengths, dummy gate line positions, and distances to ensure manufacturability and flexibility, allowing for the use of these cells in a single routing block without overlapping during the gate line cut process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If standard cells with different cell heights are used to provide design flexibility, then adaptability is improved, but layout regularity deteriorates causing space waste and reduced automation efficiency
Solution Approach 1:
The patent changes the height parameter of standard cells to be uniform while allowing width parameters to vary. This parameter transformation maintains design flexibility through width variation while achieving layout regularity through height unification, enabling efficient automated routing and placement processes.
2Adaptability or versatility
If standard cells with different cell heights are used to accommodate various functions, then adaptability is improved, but area utilization deteriorates due to irregular patterns and blank areas
Solution Approach 1:
The patent transforms the cell height parameter to a fixed value while allowing cell width to vary according to functional requirements. This parameter change eliminates vertical irregularities and blank spaces in the layout, achieving continuous and efficient area utilization while preserving design flexibility through width variation.
3Shape
If standard cells with different cell heights are separated into different routing blocks, then layout regularity is improved, but device complexity increases due to extended metal interconnections
Solution Approach 1:
The patent unifies the height parameter of all standard cells to enable them to be placed in the same routing block. This parameter unification maintains layout regularity while avoiding the need for complex metal interconnections between separate blocks, thereby reducing overall device complexity.
Data Source
AI summary
An integrated circuit layout includes an upper active region comprising a first edge and a second edge extending along a first direction and respectively adjacent to an upper cell boundary by a distance D3 and a distance D4. A first gate line is disposed on the upper active region, extends along a second direction, and protrudes from the first edge by a length L3. A second gate line is disposed on the upper active region, extends along the second direction, and protrudes from the second edge by a length L4. Two dummy gate lines respectively extend along the second direction and are disposed at two sides of the upper active region and away from the upper cell boundary by a distance S. The first direction and the second direction are perpendicular. The distances D3, D4, S and the lengths L3 and L4 have the relationships: L3≤D3−S, L4≤D4−S, and D3≠D4.