Standard Cell Power Segment Layout for Denser IC Routing
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Solution Overview
Problem
The miniaturization of semiconductor manufacturing processes leads to challenges in efficiently utilizing metal resources in standard cells, affecting the size and arrangement of patterns, which impacts the efficiency of integrated circuits.
Innovation Solution
Incorporating power segments in standard cells with a pattern of the third metal layer extending in a second direction, and replacing portions of power lines with signal segments, while maintaining efficient power and signal transmission through tracks with both power and signal segments on the same track.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of patterns in standard cell is decreased due to miniaturization, then the size of standard cell is reduced, but the efficiency of metal resource utilization deteriorates
Solution Approach 1:
The metal layer is divided into multiple segments including power segments and signal segments. Power segments are specifically configured to provide power to standard cells while signal segments transmit signals. This segmentation allows optimized routing for different functions, improving metal resource utilization efficiency even as standard cell size decreases due to miniaturization.
Solution Approach 2:
The patent introduces a vertical dimension by stacking multiple metal layers (first, second, and third metal layers) in the vertical direction. Power segments in the third metal layer extend in a direction different from the standard cell arrangement, utilizing the vertical dimension to improve metal resource utilization without increasing the horizontal footprint of the standard cell.
2Adaptability or versatility
If power lines are replaced with signal segments, then the connectivity between standard cells is improved, but the power transmission capability may be compromised
Solution Approach 1:
The conductive patterns are segmented into distinct power segments and signal segments. Power segments are specifically designed to provide power to standard cells, while signal segments are designed for signal transmission. This segmentation ensures that power transmission and signal connectivity functions are independently optimized and maintained.
Solution Approach 2:
The metal layer structure is designed to support both power transmission and signal transmission functions through different segments of the same layer. The third metal layer, for example, contains power segments that provide power while also supporting signal routing, achieving multi-functionality without compromising either power transmission capability or connectivity.
Data Source
AI summary
An integrated circuit includes a plurality of standard cells including first and second standard cells arranged adjacent to each other in a first direction, and first, second, and third metal layers sequentially stacked in a vertical direction. At least one power segment is arranged adjacent a region where at least one of the first standard cell and the second standard cell is arranged. The at least one power segment is configured to provide power to the plurality of standard cells and is formed as a pattern of the third metal layer extending in a second direction.