Standard Cell Wiring Layout With Variable Pitch Power Routing
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Solution Overview
Problem
As demand for high-performance, high-speed, and multifunctional semiconductor devices increases, there is a need for more efficient layout design of metal wiring in highly integrated semiconductor devices to enhance integration and performance.
Innovation Solution
The semiconductor device incorporates a substrate with standard cells arranged in rows, featuring active patterns, gate structures, source/drain regions, and contact structures, along with power lines that supply power to the cells, where neighboring wiring lines are arranged at different spacings and pitches to optimize layout efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If standard cells are arranged in a highly integrated layout to increase device functionality, then the integration degree and performance improve, but the layout design complexity and difficulty of metal wiring arrangement increase
Solution Approach 1:
The patent divides the semiconductor device into standardized cell units, each containing discrete functional elements (active patterns, gate structures, source/drain regions, contact structures). This segmentation allows independent design and optimization of each cell while maintaining overall system integration, thereby managing layout complexity through modular organization.
Solution Approach 2:
The patent creates universal standard cells that can be repeatedly used throughout the semiconductor device. Each standard cell contains multi-functional elements that can serve different purposes depending on configuration, allowing the same cell design to be applied across multiple locations and functions, reducing overall design complexity while maintaining high integration.
2Quantity of substance
If metal wiring is densely arranged to increase integration, then the device density improves, but the manufacturing precision requirements and potential for wiring conflicts increase
Solution Approach 1:
The patent applies different spacing and pitch configurations to wiring lines based on their local functional requirements. Critical wiring paths receive greater spacing for manufacturing tolerance, while less critical paths use tighter spacing to maximize density. This localized optimization allows high overall density while maintaining necessary precision in critical areas.
Solution Approach 2:
The patent employs asymmetric wiring arrangements where neighboring wiring lines have different spacings and pitches rather than uniform spacing. This asymmetric design optimizes the layout by placing wider spacings where manufacturing variations are most critical and tighter spacings where density is prioritized, thereby achieving high device density without proportionally increasing manufacturing precision requirements.
Data Source
AI summary
A semiconductor device includes a substrate having an active region, a first group of standard cells arranged in a first row on the active region of the substrate and having a first height defined in a column direction, a second group of standard cells arranged in a second row on the active region of the substrate, and having a second height, and a plurality of power lines extending in a row direction and respectively extending along boundaries of the first and the second groups of standard cells. The first and second groups of standard cells each further include a plurality of wiring lines extending in the row direction and arranged in the column direction, and at least some of wiring lines in at least one standard cell of the first and second groups of standard cells are arranged at different spacings and/or pitches.