Reusable Standard Cell Wafer Layout for Flexible Die Manufacturing
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Solution Overview
Problem
The development of electronic devices with diverse modules leads to increased costs and long development cycles due to the need for multiple types of wafers, each designed for specific functional cells, resulting in difficulties in stocking and complex wiring within modules.
Innovation Solution
Defining minimum repetitive functional cells as standard cells that can be reused across different modules, reducing the number of wafer types and implementing electrical connections between these cells through scribing channels to simplify module manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different wafers are designed for different functional cells in SIP modules, then functional diversity is achieved, but development costs increase and development cycle lengthens
Solution Approach 1:
The wafer is segmented into multiple independent functional cells (filter cell, amplifier cell, switch cell), each capable of being independently designed and manufactured. These standardized cells can then be combined in different configurations to create diverse SIP module functions, reducing the need for completely different wafer designs for each module type.
Solution Approach 2:
A universal wafer design incorporates multiple types of functional cells (filter, amplifier, switch) that can serve different purposes depending on how they are configured and connected. This multi-functional wafer can support various SIP module requirements without needing separate specialized wafers for each function.
2Reliability
If different wafers are designed for different functional cells, then specific module functions are optimized, but wafer stocking becomes difficult
Solution Approach 1:
By segmenting the wafer into standardized functional cells, a limited set of cell types can be manufactured and stocked. When a specific module is needed, the appropriate cells are selected and combined, eliminating the need to stock completely different wafers for each module variant.
Solution Approach 2:
The functional characteristics of the wafer are adjusted by changing which functional cells are activated or connected, rather than requiring different physical wafers. This allows a single wafer design to serve multiple module configurations through parameter changes in cell activation and interconnection.
3Reliability
If multiple wafer types are used for different modules, then module-specific performance is achieved, but wiring complexity increases
Solution Approach 1:
The wiring complexity is reduced by segmenting the interconnections into standardized patterns that connect standardized functional cells. Instead of custom wiring for each module type, the same cell types use the same connection patterns, simplifying the overall wiring architecture.
Solution Approach 2:
Standardized wiring patterns are copied and reused across different module configurations. Once a wiring pattern is established for connecting functional cells, the same pattern can be replicated for different modules, reducing design complexity and error potential.
Data Source
AI summary
A method includes cutting a wafer to obtain a first die and a second die. The wafer includes X minimum standard cells with a same function, a scribing channel is between two adjacent minimum standard cells among the X minimum standard cells with the same function, and pads with the same function of the adjacent minimum standard cells are electrically connected through the scribing channel by metal wiring for an integrated circuit process. The minimum standard cells are minimum repetitive functional cells in a plurality of receiving modules with the same functional cell. The first die includes K minimum standard cells with the same function, and K is an integer greater than or equal to 1. The second die includes L minimum standard cells with the same function, L is an integer greater than or equal to 1, and L and K are not equal.