Standardized FPGA Logic Drive Architecture for Lower NRE Cost
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Solution Overview
Problem
The high Non-Recurring Engineering (NRE) costs and inefficiencies of transitioning from Field Programmable Gate Arrays (FPGA) to Application Specific IC (ASIC) or Customer-Owned Tooling (COT) chips for advanced semiconductor technology nodes hinder innovation and scalability in logic drives.
Innovation Solution
Utilizing standardized commodity logic drives comprising multiple FPGA IC chips and non-volatile memory IC chips, which reduce NRE costs by enabling field programming and software development, allowing for efficient workload processing and application acceleration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If FPGA IC chips are used for advanced semiconductor technology nodes, then adaptability and ease of programming are improved, but fabrication cost, chip size, and power consumption increase
Solution Approach 1:
The system segments the logic drive function across multiple FPGA IC chips working in parallel, with each chip handling a portion of the workload. This allows the use of smaller, more cost-effective FPGA chips at advanced technology nodes while maintaining overall system capability through parallel processing architecture.
Solution Approach 2:
The patent creates a universal logic drive platform using standardized FPGA chips that can be programmed for different applications. The same hardware platform serves multiple functions through field-programmable logic, eliminating the need for custom ASIC designs for each application and reducing fabrication costs at advanced nodes.
2Adaptability or versatility
If FPGA IC chips are used for advanced semiconductor technology nodes, then adaptability and ease of programming are improved, but chip size increases
Solution Approach 1:
The logic drive functionality is segmented across multiple smaller FPGA chips rather than requiring one large FPGA chip. Each individual chip has a reduced footprint, and the collective array of chips provides the necessary adaptability and processing capacity through parallel operation.
Solution Approach 2:
The patent transitions from a single-chip architecture to a multi-chip array architecture, effectively moving the problem from two-dimensional chip area constraints to a three-dimensional system-level arrangement where multiple smaller chips are organized in a package or substrate.
3Adaptability or versatility
If FPGA IC chips are used for advanced semiconductor technology nodes, then adaptability and ease of programming are improved, but power consumption increases
Solution Approach 1:
The system divides the computational workload across multiple FPGA chips, allowing each chip to operate at lower power levels. The segmented architecture enables more efficient power management where only active logic regions in each chip consume significant power, rather than a single large FPGA chip where more logic is simultaneously active.
Solution Approach 2:
The patent implements dynamic power management where FPGA logic regions are activated or deactivated based on workload demands. This periodic or on-demand activation reduces average power consumption while maintaining adaptability, as chips or logic regions can be powered down when not needed and activated when required.
4Productivity
If ASIC or COT IC chips are used instead of FPGA, then performance and power consumption are improved, but NRE cost and manufacturing flexibility worsen
Solution Approach 1:
The patent creates a dynamic system where the logic drive can be reprogrammed in the field to adapt to different workloads and applications. This dynamic reconfigurability provides ASIC-like performance for specific applications while avoiding the high NRE costs of custom ASIC design, as the same hardware platform can be software-defined for different functions.
Solution Approach 2:
The system changes the operational parameters of the FPGA chips through field programming and configuration, optimizing performance for specific applications without requiring physical hardware changes or expensive custom fabrication. Parameter changes in the logic configuration achieve ASIC-like specialization while maintaining the flexibility and lower NRE cost of programmable devices.
Data Source
AI summary
A chip package includes an interposer comprising a silicon substrate, multiple metal vias passing through the silicon substrate, a first interconnection metal layer over the silicon substrate, a second interconnection metal layer over the silicon substrate, and an insulating dielectric layer over the silicon substrate and between the first and second interconnection metal layers; a field-programmable-gate-array (FPGA) integrated-circuit (IC) chip over the interposer; multiple first metal bumps between the interposer and the FPGA IC chip; a first underfill between the interposer and the FPGA IC chip, wherein the first underfill encloses the first metal bumps; a non-volatile memory (NVM) IC chip over the interposer; multiple second metal bumps between the interposer and the NVM IC chip; and a second underfill between the interposer and the NVM IC chip, wherein the second underfill encloses the second metal bumps.


