Standardized Package Assembly for Variable Sensor Sizes
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Solution Overview
Problem
The increasing variety in sensor sizes and circuit boards due to differing detection accuracy requirements leads to a proliferation of package types for electronic devices, complicating manufacturing processes.
Innovation Solution
A method for manufacturing electronic devices that involves housing sensors and circuit boards within standardized packages of the same size, despite differences in sensor sizes and detection capabilities, by carefully arranging and bonding the components within these packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If sensors and circuit boards are housed in standardized packages of the same size, then the number of package types is reduced and manufacturing complexity is decreased, but the arrangement and bonding of components within the package becomes more complex
Solution Approach 1:
The patent segments the assembly process into two distinct stages: first mounting the circuit board on the package, then separately mounting the sensor on the circuit board. This segmentation allows each component to be positioned independently, accommodating various sensor sizes within the same standardized package without complicating the overall manufacturing process.
Solution Approach 2:
The circuit board is preliminarily mounted on the package in a fixed position before the sensor is mounted. This preliminary action establishes a stable base structure, allowing sensors of different sizes to be subsequently positioned at appropriate locations on the circuit board without affecting the package's overall dimensions or requiring reconfiguration of the package itself.
2Productivity
If different sized sensors are accommodated in the same package type, then manufacturing efficiency is enhanced and cost is reduced, but the sensor mounting process becomes more complex
Solution Approach 1:
The patent applies local quality by allowing the circuit board to serve as a customized mounting platform for different sensor sizes, while the package itself maintains standardized dimensions. The circuit board's surface can be locally adapted to accommodate various sensor footprints, enabling mass production of standardized packages with customized sensor configurations.
Solution Approach 2:
The patent resolves the size variation issue by introducing an intermediate dimension - the circuit board - between the standardized package and the variable-sized sensor. This additional layer allows sensors of different planar dimensions to be mounted on the same package type through the circuit board's flexible routing and mounting capabilities.
3Ease of manufacture
If the circuit board is mounted on the package before the sensor, then the mounting process is simplified and standardized, but the sensor size variations must be accommodated on the already-mounted circuit board
Solution Approach 1:
The patent introduces dynamic adaptability by allowing the sensor mounting position and orientation on the circuit board to be adjusted based on sensor size requirements. While the circuit board's position on the package is fixed and standardized, the sensor's placement on the circuit board can be dynamically configured to accommodate different sensor dimensions, maintaining both manufacturing simplicity and adaptability.
Data Source
AI summary
In a method for manufacturing an electronic device, a first electronic device includes a first sensor, a second sensor, a first circuit board, and a first package, a second electronic device includes a third sensor, a fourth sensor, a second circuit board, and a second package, the first package and the second package have the same size in plan view, the second sensor has a size smaller than a size of the fourth sensor in plan view, the first circuit board and the second circuit board have the same size in plan view, and the method includes: mounting the first circuit board on the first package and then mounting the second sensor; and mounting the fourth sensor on the second package and then mounting the second circuit board.