Standardized Probe Base Plate for IC Electrical Testing
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Solution Overview
Problem
Conventional electrical connecting apparatuses for integrated circuits require custom probe base plates, making them expensive and difficult to produce due to variations in electrode positions, functions, sizes, and arrangements, leading to high manufacturing costs.
Innovation Solution
A standardized electrical connecting apparatus with a wiring base plate and a probe base plate connected via screw members, utilizing sheet-like members with intersecting wirings and a pressing device to ensure electrical contact, allowing for a common arrangement pattern and connection pattern that can accommodate different integrated circuit types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If custom probe base plates are manufactured for each integrated circuit type, then electrical connection reliability is improved, but manufacturing cost increases and production difficulty increases
Solution Approach 1:
The probe base plate is divided into a standardized base portion and interchangeable probe tip portions. The base plate structure itself is standardized and reusable, while only the probe tip portions needing to contact specific IC electrodes are customized. This segmentation allows the majority of the base plate to be mass-produced standardly, reducing manufacturing complexity and cost while maintaining reliable electrical connections through the customized tip portions.
Solution Approach 2:
The standardized base plate design serves multiple functions across different IC types. The common base plate structure with standardized conductive patterns and mounting interfaces can be used for various IC packages and electrode arrangements, making it a universal platform. Only the specific probe contact portions need adaptation, allowing one base plate design to serve multiple applications.
2Reliability
If custom probe base plates are manufactured for each integrated circuit type, then electrical connection reliability is improved, but production cost increases
Solution Approach 1:
By segmenting the probe base plate into standardized base portions and customized probe tip portions, the invention enables mass production of the expensive base plate components as standard items. Only the relatively simpler probe tip portions require customization per IC type, significantly reducing overall production costs while maintaining connection reliability.
Solution Approach 2:
The standardized base plate can be recovered and reused across multiple IC testing applications. Instead of manufacturing a complete custom base plate for each IC type, the durable standardized base is retained and reused, while only the consumable or interchangeable probe tip portions are replaced or adjusted for different IC configurations.
3Ease of manufacture
If standardized probe base plate is used, then manufacturing cost is reduced and production is simplified, but adaptability to different integrated circuit types must be maintained
Solution Approach 1:
The segmentation of the probe base plate into standardized base portions and interchangeable probe tip portions enables both standardization and adaptability. The standardized base provides manufacturing simplicity, while the interchangeable tips can be configured to match different IC electrode arrangements, positions, and functions.
Solution Approach 2:
The probe base plate system incorporates dynamic adaptability through interchangeable and adjustable probe tip portions. While the base plate structure remains static and standardized, the probe tips can be dynamically changed or reconfigured to adapt to different IC types, maintaining versatility without compromising manufacturing standardization.
Data Source
AI summary
The electrical connecting apparatus comprises: a wiring base plate having a first surface provided with a plurality of first conductive portions; a probe base plate having a second surface provided with a plurality of second conductive portions with its second surface opposed to the lower surface; a plurality of screws for removably coupling the wiring base plate and the probe base plate; and a connecting device for electrically connecting the first and second conductive portions.