Standoff Circuit Board Structure for High-Voltage Charge Noise
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Solution Overview
Problem
Conventional circuit boards in high-voltage applications suffer from charge noise due to high charges, which can degrade sensitivity and cause permanent damage to components, and encapsulants used to mitigate noise introduce additional drawbacks.
Innovation Solution
A two-and-a-half-dimensional structure is employed, using two separated circuit boards with a capacitor's electrodes mounted on different boards, increasing creepage distance and reducing voltage gradient through a stacked design with spacers and standoffs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional circuit boards are used in high-voltage applications, then the circuit board can be simple in structure, but charge noise degrades sensitivity and causes permanent damage to components
Solution Approach 1:
The circuit board is divided into two separate boards (first circuit board and second circuit board) with sensitive components placed on one board and high-voltage components on the other board. This segmentation physically separates noise-sensitive components from high-voltage components, reducing charge noise interference while maintaining overall system reliability.
Solution Approach 2:
The invention transitions from a two-dimensional layout on a single circuit board to a three-dimensional stacked configuration with two separate circuit boards positioned at different vertical levels. Standoffs create vertical separation, increasing the creepage distance between high-voltage and sensitive components in the vertical dimension, thereby reducing charge noise without increasing horizontal board size.
2Object-affected harmful factors
If encapsulants are used to mitigate charge noise, then charge noise is reduced, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The invention removes the encapsulant layer entirely and replaces it with a mechanical separation structure using two distinct circuit boards positioned at different vertical levels. The standoffs and vertical spacing provide the necessary electrical isolation without requiring encapsulant materials, simplifying both device structure and manufacturing processes.
Solution Approach 2:
Standoffs serve as intermediary components that provide physical and electrical separation between the first circuit board (with high-voltage components) and the second circuit board (with sensitive components). These standoffs act as mediators that maintain the required creepage distance and reduce charge noise without requiring encapsulant materials.
3Object-affected harmful factors
If the board size is increased to reduce charge noise, then creepage distance increases and noise reduces, but the compact footprint is lost
Solution Approach 1:
The invention utilizes the vertical dimension by stacking two circuit boards at different levels with standoffs providing vertical separation. This three-dimensional arrangement increases the effective creepage distance between high-voltage and sensitive components without increasing the horizontal footprint of the overall device, maintaining compactness while reducing charge noise.
Solution Approach 2:
The two circuit boards are arranged in a nested vertical configuration where the first circuit board with high-voltage components is positioned at one vertical level and the second circuit board with sensitive components is positioned at another vertical level. This nested stacking arrangement maximizes space utilization and maintains a compact overall footprint while providing sufficient electrical separation.
Data Source
AI summary
One embodiment provides an electronic circuit device, including: a first electronic circuit board; a second electronic circuit board separated from the first electronic circuit board; at least one capacitor including two electrodes, wherein one of the two electrodes is mounted to the first electronic circuit board and wherein the other of the two electrodes is mounted to the second electronic circuit board; and at least one connector electrically coupled to at least one of the first electronic circuit board and the second electronic circuit board. Other aspects are described and claimed.