Integrated Standoff Connector for Electrical Devices
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Solution Overview
Problem
Conventional standoff mounting techniques for electronic devices are complex and costly, involving separate fabrication and multi-stage assembly, which hinders the efficient increase of integrated circuit density and thermal management in electronic systems.
Innovation Solution
Bonding standoff connectors directly to surface conductors of electrical devices during fabrication, using wire or ribbon-bonding techniques, to create a mounting distance that allows for increased circuit density and thermal management by creating a spatial volume for additional components on the PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional standoff mounting techniques are used, then devices can be stood-off from the PCB for thermal management and space utilization, but the manufacturing process becomes complex and expensive
Solution Approach 1:
The patent merges the standoff connector and the electrical device into a single integrated component. The standoff connector is formed as an integral part of the electrical device housing, eliminating the need for separate fabrication and assembly of standoffs. This integration maintains thermal management capabilities while dramatically simplifying the manufacturing process by reducing the number of components and assembly steps.
Solution Approach 2:
The electrical device housing serves multiple functions: it provides structural support, thermal management, and positioning on the PCB. The standoff connector is designed to perform both mechanical support and electrical connection functions simultaneously, eliminating the need for separate components and reducing manufacturing complexity.
2Area of stationary object
If conventional standoff mounting techniques are used, then devices can be mounted off the PCB to free up real estate, but the assembly process becomes time-consuming
Solution Approach 1:
The standoff connector is pre-formed as an integral part of the electrical device during the manufacturing process. This preliminary formation of the standoff structure eliminates the need for separate assembly steps where standoffs would be attached to devices, thereby significantly reducing assembly time and increasing productivity while maintaining the benefit of freed PCB real estate.
3Quantity of substance
If surface-mount technology is used, then circuit density increases in two-dimensional space, but thermal management becomes more difficult
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional mounting by incorporating standoffs that extend vertically from the PCB surface. This dimensional change allows devices to be positioned above the PCB plane, creating vertical spacing that improves thermal management while maintaining high circuit density through efficient use of three-dimensional space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the assembly process, reduces costs, and enhances integrated circuit density by enabling the mounting of additional components underneath the electrical device, while allowing for adjustable mounting distances to accommodate various components.
Implementation Method 1
bonding a first standoff connector to the first surface conductor. The first standoff connector includes a leg having a proximal end bonded to the first surface conductor
Implementation Method 2
using wire or ribbon-bonding techniques, to create a mounting distance
Data Source
AI summary
An apparatus includes an electrical device having a surface. The electrical device includes a first surface conductor spaced apart from a second surface conductor on the surface to provide circuit contacts to the device. A first standoff connector is bonded to the first surface conductor. The first standoff connector includes a leg having a proximal end bonded to the first surface conductor. The leg of the first standoff connector extends outwardly from the first surface conductor to a bend that is spaced apart from the surface of the electrical device. A second standoff connector is bonded to the second surface conductor. The second standoff connector includes a leg having a proximal end bonded to the second surface conductor. The leg of the second standoff connector extends outwardly from the second surface conductor to a bend that is spaced apart from the surface of the electrical device.