Standoff-Spring Fitting for Even Thermal Pressure Loading
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Solution Overview
Problem
Thermal solutions in electronic devices create uneven pressure loading and potential cracking risks on package dies due to localized pressure points, and thicker designs to mitigate this issue increase cost, weight, and z-height.
Innovation Solution
A standoff-spring combination fitting that integrates a standoff and a spring to evenly distribute pressure, reducing the thickness and weight of thermal solutions while maintaining effective cooling, by using a spring beneath the thermal solution to counteract bending and cracking risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal solutions are fastened over package dies, then thermal dissipation is achieved, but pressure points are created on the corners of package dies causing cracking risks
Solution Approach 1:
The patent employs a flexible thermal solution with integrated corner springs that can deform and conform to the package die surface. The springs act as flexible elements that distribute compression forces evenly across the corner regions, preventing stress concentration and cracking while maintaining thermal contact. This flexible design allows the thermal solution to adapt to surface irregularities without creating harmful pressure points.
Solution Approach 2:
The corner springs are pre-installed at the corners of the thermal solution before assembly, providing cushioning protection in advance. These springs are designed to compress under load, absorbing and distributing the compression forces before they can concentrate on the package die corners. This beforehand cushioning prevents cracking by ensuring forces are evenly distributed from the moment compression is applied.
2Stability of the object's composition
If thermal solution thickness is increased to mitigate bending and warping, then structural stability is improved, but cost, weight, and z-height increase
Solution Approach 1:
The patent uses a thin-film thermal solution with integrated corner springs instead of a thick rigid structure. The flexible membrane material allows the thermal solution to be thin while still providing structural stability through the spring elements at the corners. These springs provide the necessary rigidity and resistance to bending forces without requiring increased overall thickness, thereby reducing weight while maintaining structural integrity.
Solution Approach 2:
The thermal solution is segmented into a thin central membrane region and reinforced corner regions with springs. This segmentation allows the majority of the thermal solution to remain thin and lightweight, while only the critical corner areas have additional structural support through the spring elements. This localized reinforcement achieves structural stability without the penalty of increasing the weight and thickness of the entire thermal solution.
3Reliability
If thermal solution thickness is increased to reduce pressure points, then reliability is improved, but device z-height increases
Solution Approach 1:
The flexible thermal solution with corner springs achieves reliable pressure distribution through the spring elements that compress and distribute forces evenly. The thin-film construction allows this pressure distribution mechanism to function without requiring increased thickness, thereby maintaining a low device z-height while ensuring reliable operation and preventing cracking through even force distribution.
Solution Approach 2:
The corner springs provide beforehand cushioning that distributes compression forces evenly across the package die corners. This cushioning mechanism is built into the thin thermal solution structure, allowing reliable pressure distribution without increasing the overall z-height of the device. The springs compress under load to provide the necessary force distribution in a space-efficient manner.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The standoff-spring combination fitting reduces localized pressure on package dies, prevents cracking, and maintains thermal efficiency without increasing device thickness or weight, enhancing airflow and reducing radio frequency leakage.
Implementation Method 1
The spring provides precise and controlled pressure between the thermal solution and the package die or other heat source. The spring spreads tension across the thermal solution. The spring compression generates a counterforce to thermal solution bending.
Data Source
Figure 1
Figure 2A~2B
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AI summary
Example fittings that combine standoffs and springs for supporting thermal solutions are disclosed herein. An example electronic device includes a chassis; a substrate; a thermal solution; and a fitting to separate the substrate from the chassis and to separate the thermal solution from the substrate, the fitting including a standoff end and a spring end.