Star-Connected Lead Frame for IC Network Noise Isolation
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Solution Overview
Problem
Integrated circuits (ICs) experience noise interference between electronic networks due to common lead inductance, which is exacerbated by heavy inrush currents, affecting the operation of sensitive networks.
Innovation Solution
Implementing a lead frame with bifurcated supply and ground pins that form star-connected leads within the IC package, reducing common lead inductance and isolating networks from each other.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a common lead frame structure is used to connect multiple IC networks, then the device complexity is reduced and ease of manufacture is improved, but noise interference between networks increases due to common lead inductance
Solution Approach 1:
The lead frame is segmented into separate supply leads and ground leads for each IC network. Instead of using a single common lead for multiple networks, the patent divides the lead frame structure so that each network has its own dedicated supply and ground paths, eliminating common lead inductance and the associated noise interference while maintaining manufacturing feasibility.
2Power
If heavy inrush currents are allowed to flow through common leads, then the power delivery capability is improved, but noise interference affecting sensitive networks worsens
Solution Approach 1:
The patent segments the power delivery paths by providing separate supply leads for each IC network. This allows heavy inrush currents to flow through dedicated leads without affecting other networks, while sensitive networks operate on their own isolated paths, maintaining both power delivery capability and operational stability.
Solution Approach 2:
Different lead configurations are provided for different networks based on their specific requirements. Networks requiring high power delivery have leads optimized for current handling, while sensitive networks have leads optimized for low inductance and noise immunity, with each network receiving locally optimized lead quality.
Data Source
AI summary
An example packaged IC includes a lead frame having a supply pin and a ground pin. The supply pin includes first and second supply leads extending from a proximal portion of the supply pin. The ground pin includes first and second ground leads extending from a proximal portion of the ground pin. A first IC network has a first supply terminal coupled to the first supply lead via a first conductor (e.g., bond wire or bump bond). The first IC network also has a first ground terminal coupled to the first ground lead via a second conductor. A second IC network has a second supply terminal coupled to the second supply lead via a third conductor. The second IC network also has a second ground terminal coupled to the second ground lead via a fourth conductor.