Steam Injector Layout for Non-Contact Substrate Cleaning
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Solution Overview
Problem
Current semiconductor package cleaning processes often result in contamination and wear of cleaning devices, limiting productivity due to direct contact and inefficient cleaning methods.
Innovation Solution
A substrate cleaning apparatus using a steam injector with a drive unit, temperature and pressure sensors, and nozzles arranged in one direction, which forms a cleaning space to inject steam without direct contact, ensuring uniform cleaning and reducing wear, while a controller maintains optimal steam conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If direct contact cleaning methods are used, then cleaning effectiveness is improved, but device wear and contamination increase
Solution Approach 1:
The patent replaces mechanical contact-based cleaning systems with a steam injection system. The steam injector delivers high-temperature steam through nozzles to clean semiconductor substrates without physical contact, eliminating mechanical wear on cleaning components while maintaining effective cleaning through thermal and condensation mechanisms.
Solution Approach 2:
The patent utilizes steam (a gas/ vapor phase fluid) delivered through a controlled injection system with nozzles. The steam is supplied under controlled pressure and temperature conditions to achieve effective cleaning without direct mechanical contact, leveraging fluid dynamics and phase change properties.
2Manufacturing precision
If cleaning devices are replaced frequently, then cleaning quality is maintained, but productivity decreases
Solution Approach 1:
By replacing mechanical contact components with a steam injection system, the patent eliminates the wear and degradation that necessitates frequent replacements. The steam injector components experience minimal wear since they do not physically contact the substrates, significantly extending operational life and maintaining consistent cleaning quality over time.
Solution Approach 2:
The steam injection system is designed to maintain consistent cleaning performance through self-regulating mechanisms, including temperature and pressure control, ensuring sustained cleaning quality without requiring frequent intervention or component replacement.
3Device complexity
If steam parameters are not controlled, then system complexity is reduced, but cleaning consistency deteriorates
Solution Approach 1:
The patent incorporates sensors that monitor steam temperature and pressure parameters in real-time, feeding this information back to a control system. This feedback mechanism enables automatic adjustment of steam injection parameters to maintain consistent cleaning quality while managing system complexity through automated control rather than manual intervention.
Solution Approach 2:
The patent utilizes controlled changes in steam parameters (temperature, pressure, flow rate) to optimize cleaning effectiveness. By systematically controlling these physical parameters of the steam, the system achieves consistent cleaning results across different substrates and contamination levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves productivity by preventing wear and ensuring consistent cleaning quality, allowing for uniform cleaning of semiconductor packages without direct contact and maintaining optimal steam conditions for effective detergency.
Implementation Method 1
injecting a steam into the cleaning space using a steam injector... drying the semiconductor packages
Implementation Method 2
A sensor unit of the steam injector may transmit information on temperature and pressure of the steam to a controller while the steam injector injects the steam into the cleaning space
Data Source
AI summary
A substrate cleaning apparatus may include a steam injector configured to clean a substrate, a steam supplier configured to supply a steam, and a gas supplier configured to supply a gas. The steam injector may include a drive unit configured to move horizontally, a plate on the drive unit, and a plurality of nozzles on the plate. The plate may include a temperature sensor, a first pressure sensor, and a second pressure sensor. Each of the plurality of nozzles may be connected to the steam supplier and the gas supplier. The plurality of nozzles may be arranged in one direction from a planar viewpoint.