Steerable Beam Antenna With Air-Gap Scatterers for Millimeter-Wave Losses

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Solution Overview

Problem

Steerable beam antennas operating at microwave/millimeter wavelengths face challenges with increased switch-impedance contrast degradation and scatterer losses due to parasitic capacitances and inductances as operational frequency increases, limiting their effectiveness at higher millimeter-wave frequencies.

Innovation Solution

The antenna design minimizes scatterer losses by surrounding scatterers with air instead of a silicon substrate and integrates switches monolithically into semiconductor chips, eliminating parasitic influences with a three-electrode configuration that minimizes connection losses and employs air gaps to reduce dielectric losses, allowing for efficient operation at higher frequencies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If switches are integrated into scatterers to enable electronic beam steering, then beam direction control is improved, but parasitic capacitances and inductances increase causing impedance contrast degradation and scatterer losses at higher frequencies

Engineering Contradiction:
Improvebeam steering controlVSAvoidscatterer losses
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The patent extracts the scatterers from the lossy silicon substrate environment and places them in air, eliminating the parasitic capacitances and inductances that cause energy losses. This is achieved by providing scatterers that are surrounded by air rather than being embedded in a silicon substrate, directly addressing the frequency-dependent loss problem while maintaining electronic beam steering capability through integrated switches.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces air as an intermediary medium between the scatterers and the silicon substrate, separated by spacers. This air gap acts as a mediator that eliminates parasitic electromagnetic interactions between the scatterers and the lossy substrate, reducing impedance contrast degradation and energy losses at millimeter-wave frequencies.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Stability of the object's composition

If scatterers are embedded in silicon substrate for structural support, then mechanical stability is improved, but dielectric losses increase at microwave and millimeter wavelengths

Engineering Contradiction:
Improvestructural stabilityVSAvoiddielectric losses
Core Design Contradiction:
Stability of the object's compositionVSLoss of energy

Solution Approach 1:

The patent extracts the scatterers from the silicon substrate embedding and places them in air, removing the source of dielectric losses. The scatterers are no longer in direct contact with the lossy silicon substrate, eliminating the frequency-dependent dielectric losses that occur at microwave and millimeter wavelengths.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Air is introduced as an intermediary medium between the scatterers and the silicon substrate, separated by spacers. This air gap eliminates direct electromagnetic coupling between the scatterers and the lossy substrate, reducing dielectric losses while the spacers provide the necessary mechanical support and positioning.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If switches are connected to scatterers with traditional wiring, then electrical connection is achieved, but connection losses and parasitic influences increase at high frequencies

Engineering Contradiction:
Improveelectrical connectionVSAvoidconnection losses
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent merges the switch and scatterer into a single integrated structure on the antenna chip. The switch is directly connected to the scatterer without traditional wiring, eliminating connection losses and parasitic influences. This integration is achieved by forming both the switch and scatterer on the same semiconductor substrate with direct metallurgical or diffused connections.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces traditional mechanical wiring connections with direct semiconductor-level electrical connections. Instead of using wires or traces to connect switches to scatterers, the connection is made through the semiconductor material itself, eliminating the parasitic inductance and resistance associated with traditional wiring at high frequencies.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables efficient beam steering and minimizes losses, achieving low reflection and high radiation efficiency across a wide frequency range, suitable for applications in imaging radar, communication, and collision avoidance systems.

Implementation Method 1

each of the conductive scattering elements being switchable between a 'high' scattering state and a 'low' scattering state to scatter an electromagnetic wave propagating through the feed line

Methodology Applied
Scientific EffectElectromagnetic scattering: Scattering

Implementation Method 2

The antenna design minimizes scatterer losses by surrounding scatterers with air instead of a silicon substrate and integrates switches monolithically into semiconductor chips, eliminating parasitic influences with a three-electrode configuration that minimizes connection losses and employs air gaps to reduce dielectric losses

Methodology Applied
Scientific EffectDielectric loss reduction: Dielectric

Data Source

PatentUS11888223B2Steerable beam antenna
Publication Date: 2024.01.30 SIERRA NEVADA CORP
  • US11888223B2 patent drawing
  • US11888223B2 patent drawing
  • US11888223B2 patent drawing

AI summary

A steerable beam antenna includes a plurality of semiconductor chips arranged along a longitudinal axis. Each of the chips has a ground plane on its upper surface, and is doped to form an array of semiconductor switches arranged along the longitudinal axis. A corresponding array of scattering elements, each having a first leg and a second leg, is mounted on each chip along the longitudinal axis. A first electrode of each switch is configured for connection to a control circuit, a second electrode is connected to the ground plane, and a third electrode is connected to the first leg of one of the array of scattering elements, the second leg of which is connected to the ground plane. A dielectric element is mounted on the antenna chips along the longitudinal axis above the arrays of switches and scattering elements and is separated from the scattering elements by an air gap.