Stencil Cleaning Structure for Aperture and Cavity Residue Removal
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Solution Overview
Problem
Conventional stencil cleaning tools struggle to effectively remove solder paste residuals from apertures and cavities within stencils, which can adversely affect subsequent solder paste printing processes.
Innovation Solution
A stencil cleaning apparatus featuring a supporting member with protruding cleaning portions that mate with stencil cavities and a wiper for direct contact to remove residuals, allowing thorough cleaning of both apertures and cavities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning tools are used, then the device complexity is low, but the cleaning precision is insufficient to remove residuals from apertures and cavities
Solution Approach 1:
The cleaning portion is nested within the cavity of the stencil, with the cleaning portion having a smaller size than the cavity to allow it to fit inside and access residual solder paste trapped within the cavity structure
Solution Approach 2:
The cleaning apparatus transitions from conventional surface-level cleaning to three-dimensional cleaning by extending the cleaning portion into the vertical dimension of the cavity, allowing removal of residuals from both the aperture opening and the cavity interior
2Reliability
If conventional cleaning methods are used, then the operation is simple, but the cleaning effect is insufficient to ensure reliable solder bumps
Solution Approach 1:
The wiper acts as an intermediary element between the cleaning portion and the residual solder paste, providing direct contact and mechanical removal action to ensure complete cleaning of the aperture and cavity surfaces
Solution Approach 2:
The cleaning portion is pre-configured with a shape that corresponds to the cavity geometry, allowing it to be received within the cavity before the cleaning operation begins, ensuring proper positioning and contact with all surfaces that may contain residuals
Data Source
AI summary
An apparatus for cleaning a stencil, a method for forming the same and a method for cleaning a stencil are provided. The stencil comprises at least one cavity at a first surface of the stencil and a plurality of apertures extending within the stencil, and the apparatus comprises: a carrier; a supporting member attached on the carrier, and comprising a base portion and at least one cleaning portion protruding from the base portion, wherein each of the at least one cleaning portion is mateable with and receivable within one of the at least one cavity of the stencil; and a wiper detachably disposed on the supporting member, wherein the wiper is configured for being pressed against the stencil by the supporting member when the stencil is placed on the apparatus, to remove residuals within the apertures through direct contact between the wiper and the residuals.