Stencil Mask Structure for High-Aspect-Ratio Nanoscale Lithography
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Solution Overview
Problem
Existing stencil lithography masks are fragile, single-use, and suffer from height dispersion and limited angular resolution, and existing technologies have not addressed the need for high aspect ratio apertures and high angular resolution.
Innovation Solution
A stencil mask with a thicker membrane and predefined apertures, fabricated using the Clear-Oxidize-Remove-Etch (CORE) process, which allows for ultra-high aspect ratios and smooth sidewalls, enabling precise and reusable deposition patterns for nanoscale devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thin membrane is used for stencil mask, then the mask can be flexible and easy to manufacture, but the mask becomes fragile and shows big height dispersion of deposition
Solution Approach 1:
The patent changes the thickness parameter of the membrane from tens of nm to at least 200 nm (preferably at least 500 nm or 1 μm), transforming it from a thin flexible membrane to a thick rigid structure. This parameter change resolves the contradiction by providing both manufacturability through established techniques and reliability through increased mechanical strength and reduced fragility
2Ease of manufacture
If a thin membrane is used for stencil mask, then the mask can be manufactured with current techniques, but the angular resolution is limited and height dispersion is big
Solution Approach 1:
The patent changes the membrane thickness parameter to at least 200 nm (preferably at least 500 nm or 1 μm), which improves angular resolution and reduces height dispersion. The thick membrane provides better structural support for precise aperture definition and reduces deposition angle variations, achieving manufacturing precision while remaining manufacturable through adapted techniques
3Manufacturing precision
If a thick membrane is used for stencil mask, then the angular resolution and manufacturing precision are improved, but the device complexity increases
Solution Approach 1:
The patent segments the fabrication process into distinct stages: forming the thick membrane structure, defining apertures through etching, and using the resulting structure as a reusable mask. This segmentation allows the complex thick membrane structure to be manufactured using standard techniques while maintaining simplicity in the overall device architecture and operation
4Productivity
If a thin membrane is used for stencil mask, then the mask can be used for deposition, but the mask is single use and fragile
Solution Approach 1:
The patent changes the membrane thickness parameter to at least 200 nm (preferably at least 500 nm or 1 μm), which transforms the mask from a single-use thin membrane to a reusable thick structure. The increased thickness provides mechanical strength for repeated handling and deposition cycles, extending the duration of action while maintaining productivity through consistent performance across multiple uses
Data Source
AI summary
The disclosure relates to a stencil mask, a method for manufacturing the stencil mask and use of the stencil mask in nanoscale device nanofabrication, including imprinting on substrates of deposition patterns for nanoscale devices. One embodiment relates to a stencil mask for manufacturing at least one nanoscale device on a substrate, the stencil mask comprising, a membrane having a top surface and bottom surface and a thickness therebetween of at least 500 nm, a predefined pattern of apertures extending through the membrane, each aperture having a width and a length in the top surface of the membrane, wherein at least the width and/or the length of one of said apertures is of less than 100 nm, each aperture defined by inner sidewalls extending between the top surface and the bottom surface of the membrane, and a set of separating nanostructures on the top surface of the membrane for separating the top surface of the membrane from a top surface of the substrate.