Dry Powder Stencil Printing Solid Electrolytic Capacitor Anodes
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Solution Overview
Problem
The manufacturing process for solid electrolytic capacitors is time-consuming and expensive due to the need for multiple steps, including cutting channels in thicker substrates, which limits volumetric efficiency and increases costs.
Innovation Solution
A method involving stencil printing of dry powder to form anodic components and seed layers, followed by sintering, to create capacitor elements with reduced material usage and processing steps, allowing for thinner substrates and improved efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple cutting steps are performed to produce transverse and longitudinal channels, then discrete capacitor elements are formed, but manufacturing time and cost increase significantly
Solution Approach 1:
The patent divides the continuous seed layer and anode layer into discrete capacitor elements through patterned masking and selective deposition. By using masks with predefined patterns, the continuous layers are segmented into individual capacitor units without requiring multiple cutting steps, thus reducing manufacturing complexity while maintaining precision.
Solution Approach 2:
The patent performs preliminary patterning of the seed layer and anode layer before final element separation. By pre-defining the locations and shapes of discrete capacitor elements through masked deposition, the subsequent separation process is simplified, eliminating the need for time-consuming orthogonal cutting operations.
2Manufacturing precision
If thicker substrates are used to accommodate cutting channels, then discrete capacitor elements can be formed, but volumetric efficiency decreases
Solution Approach 1:
The patent transitions from three-dimensional cutting operations to two-dimensional planar patterning. By forming discrete capacitor elements through masked deposition on the substrate surface, the need for deep orthogonal cutting channels is eliminated. This dimensional shift allows thin substrates to be used while still achieving precise discrete element formation, thereby improving volumetric efficiency.
Solution Approach 2:
The patent replaces mechanical cutting operations with a deposition-based patterning process. Instead of using mechanical tools to cut channels into thick substrates, the invention uses masked deposition to selectively form discrete capacitor elements on thinner substrates, substituting a more efficient manufacturing approach that reduces material waste and improves volumetric efficiency.
3Quantity of substance
If continuous seed layers and anode layers are formed, then material usage is efficient, but additional cutting steps are required to create discrete elements
Solution Approach 1:
The patent combines the seed layer formation and anode layer formation into a single integrated process sequence. By depositing both layers through masked patterning in succession, the continuous layers are simultaneously formed and segmented into discrete elements, merging multiple operations into one efficient process that reduces both material waste and manufacturing steps.
Solution Approach 2:
The patent performs preliminary patterning of both seed and anode layers before element separation. By using masks to pre-def ine the discrete element patterns during deposition, the continuous layers are converted into discrete structures in advance, eliminating the need for subsequent cutting steps and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing time and cost, increases volumetric efficiency, and achieves higher capacitance with reduced Equivalent Series Resistance (ESR) while maintaining comparable leakage current and dissipation factor.
Implementation Method 1
selectively printing a plurality of printed powder portions on the substrate by placing dry valve metal powder into selected ones of the plurality of apertures defined in the stencil
Implementation Method 2
sintering the printed powder portions to form respective anodic components for multiple respective electrolytic capacitors
Data Source
AI summary
Solid electrolytic capacitors and related methods for forming such capacitors may variously involve forming at least one of a seed, grip, reference point and/or anode body by stencil printing of dry powder. In accordance with a method of forming anodic components for electrolytic capacitors, a stencil is positioned adjacent to a substrate, the stencil being formed to define a plurality of apertures therethrough. A plurality of printed powder portions are selectively printed on the substrate by placing dry powder into selected ones of the plurality of apertures defined in the stencil. The printed powder portions are then sintered to form respective anodic components for multiple respective electrolytic capacitors.