Stencil Printer Vacuum Attraction Stability
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Solution Overview
Problem
In the surface-mount circuit board production process, stencil printers face challenges in maintaining the stability of the stencil during and after printing, leading to potential movement or shaking, which can cause residual solder paste to drip onto the printed circuit board, affecting processing accuracy.
Innovation Solution
The stencil printer incorporates a clamping assembly and attraction portion with a vacuumizing device, allowing the stencil support to apply and maintain an attraction force to the stencil, preventing movement and vibration during and after printing, and a control device to manage the attraction operation, ensuring the stencil remains stable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the stencil support is moved away from the stencil after printing, then the printing operation is completed and the circuit board can be released, but the stencil may move or shake causing residual solder paste to drip onto the circuit board
Solution Approach 1:
The stencil support system transitions between different states: during printing, the attraction portion is clamped to maintain stencil stability; after printing, the clamping assembly releases to allow the stencil support to move away. This dynamic state change enables the system to achieve both stability during operation and productivity after operation.
Solution Approach 2:
The clamping assembly is activated before the printing operation to clamp the attraction portion, ensuring the stencil is secured in advance. This preliminary action prevents stencil movement during the critical printing phase, and the system is prepared for release after printing completes.
2Manufacturing precision
If the attraction portion is clamped during printing, then the stencil remains stable and printing accuracy is improved, but the holder cannot move relative to the attraction portion
Solution Approach 1:
The system employs dynamic clamping where the clamping assembly activates the attraction portion only during the printing operation. During this period, the holder is prevented from moving relative to the attraction portion, ensuring printing accuracy. After printing, the clamping is released, allowing the holder to move freely as needed.
Solution Approach 2:
The clamping and releasing of the attraction portion occurs periodically - clamped during printing operations and released between operations. This periodic action allows the system to alternate between maintaining precision (when clamped) and enabling movement (when released).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents residual solder paste from dripping onto the printed circuit board by maintaining the stencil's stability, enhancing printing accuracy and preventing contamination.
Implementation Method 1
a vacuumizing device connected to the attraction portion by means of the executing device, the vacuumizing device being capable of providing the attraction force to the attraction portion
Data Source
AI summary
The present disclosure provides a stencil printer comprising a stencil support and a clamping assembly, wherein the stencil support is movable relative to a stencil and comprises a holder and an attraction portion, the holder being movably connected to the attraction portion, and the attraction portion being capable of applying an attraction force to the stencil; and the clamping assembly is capable of clamping or releasing the attraction portion, and when the attraction portion is clamped by the clamping assembly, the holder is capable of moving a predetermined distance relative to the attraction portion in a direction away from the attraction portion and the attraction portion is capable of keeping in position relative to the stencil. The stencil printer in the present disclosure can prevent residual solder paste on the stencil from dripping due to shaking of the stencil when a processing element is away from the stencil.