Stencil Structure for Precise Conductive Placement in HPC Packages
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Solution Overview
Problem
As high-performance computing (HPC) components in semiconductor packages increase in size, challenges arise in maintaining accurate placement and preventing displacement of conductive structures during the packaging process.
Innovation Solution
The use of a stencil structure with slidably disposed stencil units and conductive structures within openings, combined with a temporary carrier and redistribution structure, allows for precise placement and connection of conductive structures, addressing the issue of conductive structure displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the package size is increased to accommodate HPC components, then the computing performance and data rate are improved, but the stability and placement accuracy of conductive structures deteriorate
Solution Approach 1:
The package structure is divided into multiple layers including substrate, encapsulant, and conductive structures at different levels. This segmentation allows each layer to be optimized independently for its function while maintaining overall structural integrity and placement accuracy despite the large package size.
Solution Approach 2:
Conductive structures are formed and positioned within the encapsulant before final package assembly. This preliminary action ensures accurate placement is achieved during the formation process rather than relying on post-assembly adjustment, maintaining precision throughout the manufacturing process.
2Productivity
If the package size is increased for HPC components, then the bandwidth and data rate are improved, but the risk of conductive structure displacement and overturning increases
Solution Approach 1:
Conductive structures are nested within the encapsulant material, with the encapsulant serving as a protective matrix that holds the conductive structures in place. This nesting arrangement prevents displacement and overturning while maintaining the structural integrity needed for high-speed data transmission.
Solution Approach 2:
The encapsulant acts as an intermediary material between the substrate and the conductive structures, providing mechanical support and stabilization. This intermediary layer prevents direct contact and potential displacement between conductive structures while maintaining electrical connectivity.
3Ease of manufacture
If conventional packaging methods are used for large HPC packages, then the manufacturing process is simple, but the quality and reliability of conductive structure placement deteriorates
Solution Approach 1:
The manufacturing process incorporates specific parameter changes including controlled formation of conductive structures within the encapsulant, precise positioning during encapsulation, and optimized curing conditions. These parameter changes maintain relatively simple manufacturing steps while significantly improving placement accuracy and structural stability.
Data Source
AI summary
A method of fabrication a package and a stencil structure are provided. The stencil structure includes a first carrier having a groove and stencil units placed in the groove of the first carrier. At least one of the stencil units is slidably disposed along sidewalls of another stencil unit. Each of the stencil units has openings.