Stent-Wrapped Thin-Film Neural Interface for Stable Electrode Adhesion
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Solution Overview
Problem
Conventional thin-film neural interfaces face mechanical instability and reliability issues due to manually attached electrodes, which can lead to open circuits and are not suitable for long-term use, and there is a need for smaller electrodes with higher density for improved electrical stimuli.
Innovation Solution
A thin-film neural interface with a stent-assisted deployment method, where electrodes are embedded in encapsulation layers and helically wrapped around a stent, providing improved adhesion and mechanical stability, and a manufacturing process involving heat shrink tubes and polymer layers to form a monolithic structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are manually attached to the thin-film neural interface, then the device can be fabricated with existing techniques, but the electrodes exhibit mechanical instability and reliability issues leading to open circuits
Solution Approach 1:
The patent merges the electrode fabrication process with the thin-film substrate manufacturing by using photolithography to directly pattern electrodes onto the thin-film substrate. This integration eliminates separate manual attachment steps and ensures inherent mechanical stability and reliability of electrode connections throughout the device lifecycle.
Solution Approach 2:
The patent replaces manual mechanical attachment of electrodes with a photolithographic patterning process that directly forms electrodes as an integral part of the thin-film structure. This substitution eliminates mechanical instability associated with manual attachment while maintaining ease of manufacture through standardized semiconductor fabrication techniques.
2Object-affected harmful factors
If conventional lead assemblies are used for deep implants, then the lead assembly provides structural support, but the device size and invasiveness increase
Solution Approach 1:
The patent employs thin-film substrates with integrated electrodes that are significantly thinner and more flexible than conventional lead assemblies. These thin-film structures provide sufficient structural support for neural interfacing while minimizing implant invasiveness and enabling delivery through smaller access points.
Solution Approach 2:
The patent transitions from three-dimensional bulky lead assemblies to two-dimensional thin-film structures. This dimensional reduction eliminates the need for large implantable components while maintaining electrical functionality, thereby reducing implant invasiveness without sacrificing structural support capabilities.
3Reliability
If standard electrode spacing is used, then the design is simple, but the electrical stimulation effectiveness is limited
Solution Approach 1:
The patent implements variable electrode spacing and density patterns directly into the thin-film substrate through photolithographic design. Different regions of the thin-film can have optimized electrode configurations tailored to specific neural targets, enhancing electrical stimulation effectiveness while managing device complexity through integrated design.
Solution Approach 2:
The patent utilizes photolithography to precisely control electrode dimensions, spacing, and density parameters during fabrication. This enables optimization of electrical stimulation effectiveness by adjusting electrode geometry and arrangement parameters without increasing overall device complexity, as all parameters are defined in the fabrication design stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances electrode adhesion, reduces mechanical failure, and allows for a minimally invasive implant with greater design flexibility, enabling multiple electrode interfaces and therapeutic opportunities for neurostimulation.
Implementation Method 1
one or more encapsulation layers encasing a portion of the first portion of the supporting structure
Implementation Method 2
a stent at least partially embedded in the one or more encapsulation layers, where the thin-film neural interface is helically wrapped around at least a portion of the stent
Implementation Method 3
one or more conductive traces formed on the second portion of the supporting structure and electrically connected with the wiring layer
Data Source
AI summary
The present disclosure relates to thin-film lead assemblies and neural interfaces with stent-assisted deployment, and methods of microfabricating thin-film lead assemblies and neural interfaces. Particularly, aspects of the present disclosure are directed to a medical device having a thin-film neural interface, a stent, and a cable. The thin-film neural interface includes a first supporting structure, electrodes formed on the first supporting structure, and an encapsulation material encasing a portion of the first supporting structure. The cable includes a second supporting structure, conducive traces formed on the second supporting structure and electrically connected with the electrodes, and the encapsulation material encasing at least a portion of the second supporting structure. The stent is at least partially embedded in the encapsulation material encasing the portion of the first supporting structure, and the thin-film neural interface is helically wrapped around at least a portion of the stent.