Step Compensation Member for Display Pad Ultrasonic Bonding
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Solution Overview
Problem
Display panels in display devices often experience crack defects during the ultrasonic bonding process, which affects the reliability and performance of the devices.
Innovation Solution
The display device incorporates a display panel with a main area, a sub-area overlapping the main area, and a bending area between them. A first lower film is placed on the display panel's surface in the main area, a second lower film is placed on the sub-area surface exposing a pad area, and a step compensation member is positioned on the pad area to reduce crack defects during ultrasonic bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ultrasonic bonding is performed to connect the driving chip to the display panel, then the bonding strength and electrical connection are improved, but crack defects occur in the display panel due to stress concentration
Solution Approach 1:
A step compensation member is introduced as an intermediary element between the driving chip and the display panel. This member has a stepped structure with different thicknesses that corresponds to the height difference between the bonding area and the pad area, thereby distributing the bonding stress and preventing crack formation in the display panel during ultrasonic bonding.
Solution Approach 2:
The step compensation member changes the physical parameters (height/thickness) in the bonding region to match the height difference between the bonding area and pad area. By adjusting the thickness parameters of the step compensation member, the stress distribution during bonding is optimized, preventing crack defects while maintaining strong bonding.
2Adaptability or versatility
If the display panel has a bending area between main area and sub-area, then flexibility and foldability are improved, but stress concentration occurs during bonding process
Solution Approach 1:
The step compensation member is specifically positioned only in the pad area where height difference exists, while the bonding area maintains its original structure. This localized compensation approach addresses the stress concentration issue in the bending area without affecting the overall flexibility and foldability of the display panel.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described configuration effectively reduces crack defects in the display panel during ultrasonic bonding, enhancing the reliability and performance of the display device by ensuring stronger and more efficient bonding between the display panel and the driving chip.
Implementation Method 1
directly connecting a bump of the driving chip onto a pad electrode provided on the second surface of the pad area
Data Source
AI summary
The present application relates to a display device and a method of providing the same. A display device includes a display panel which is bendable, the display panel including a bending area and a pad area which is adjacent to the bending area, and a lower layer extending along the pad area of the display panel. The lower layer includes a lower film layer defining an opening at the pad area, the opening exposing a portion of the pad area to outside the lower film layer, and a step compensation member which is in the opening of the lower film layer and on the portion of the pad area which is exposed to outside the lower film layer.