Step-Shaped Floating Gate for Flash Memory Coupling Ratio
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Solution Overview
Problem
Flash memory devices face challenges in power consumption and data retention/erase performance, as existing structures do not efficiently optimize the coupling ratio between the floating gate and control gate, leading to suboptimal programming voltage and uniformity of the inter-gate dielectric layer.
Innovation Solution
The implementation of non-vertical step-shaped floating gate structures with varying outer sidewall thicknesses, which enhance the coupling ratio by increasing the top surface area and improving the capacitance between the floating gate and control gate, allowing for reduced programming voltage while maintaining performance and enabling different retention and erase capabilities on the same chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional floating gate structures are used, then manufacturing is simpler, but coupling ratio between floating gate and control gate is insufficient
Solution Approach 1:
The floating gate structure transitions from a conventional planar configuration to a three-dimensional stepped configuration with multiple levels. This dimensional change increases the effective surface area of the floating gate that interfaces with the control gate, thereby enhancing the coupling ratio without simply scaling up the lateral dimensions
Solution Approach 2:
The floating gate is divided into multiple stepped levels or terraces, creating a segmented structure. Each step provides an additional interface area with the control gate, and the segmentation allows for optimized electrical field distribution across different regions of the gate structure
2Use of energy by moving object
If conventional floating gate structures are used, then programming voltage requirements are standard, but power consumption is higher
Solution Approach 1:
The stepped floating gate structure enables more efficient charge storage and retrieval mechanisms, allowing for reduced programming voltages and shorter programming pulses. This effectively makes the programming operation less energy-intensive, consuming power only when needed for data programming rather than continuous power requirements
3Manufacturing precision
If conventional floating gate structures are used, then uniformity of inter-gate dielectric layer is difficult to achieve, but manufacturing process is simpler
Solution Approach 1:
The stepped floating gate structure is formed with predetermined geometry and surface characteristics before the inter-gate dielectric layer deposition. This preliminary structuring creates a more uniform substrate surface that facilitates consistent dielectric layer formation, improving uniformity of the inter-gate dielectric across the device area
4Reliability
If floating gate top surface area is increased, then coupling ratio is enhanced, but device area increases
Solution Approach 1:
Instead of increasing the lateral footprint of the floating gate, the structure utilizes vertical dimensionality with stepped levels. This allows the floating gate to achieve greater effective surface area for coupling with the control gate while maintaining a compact lateral footprint, thus improving coupling ratio without proportionally increasing the overall device area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The non-vertical step-shaped floating gate structures reduce power consumption, enhance data retention and erase performance, and improve the uniformity and conformality of the inter-gate dielectric layer, achieving improved coupling ratios and varied performance characteristics on the same chip.
Implementation Method 1
enhance the coupling ratio by increasing the top surface area and improving the capacitance between the floating gate and control gate
Data Source
AI summary
The present disclosure relates to a flash memory cell that includes a substrate and a floating gate structure over the substrate. The floating gate structure includes a first portion having a first top surface and a first thickness. The floating gate structure also includes a second portion having a second top surface and a second thickness that is different from the first thickness. The floating gate structure further includes a sidewall surface connecting the first and second top surfaces, and an angle between the first top surface and the sidewall surface of the floating gate structure is an obtuse angle. The flash memory cell also includes a control gate structure over the first and second portions of the floating gate structure.


