Step-Structured Gap Reduction Member for Sapphire Cover Panels

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Solution Overview

Problem

Cover panels for electronic devices, such as smartphones, are prone to breakage and chipping due to applied forces, as they have gaps that increase the likelihood of damage when pressure is exerted on the outer surface.

Innovation Solution

A sapphire panel is used as the cover panel with a gap reduction member having steps corresponding to the varying heights of components on a circuit board, reducing the number of gaps within the housing and enhancing resistance to breakage and chipping by distributing pressure more evenly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a sapphire panel is provided on the electronic apparatus, then resistance to breakage is improved, but gaps within the housing increase the possibility of breakage or chipping

Engineering Contradiction:

Improveresistance to breakageVSAvoidpossibility of breakage or chipping

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The gap reduction member is divided into multiple steps with different heights, each step corresponding to components of different heights on the circuit board. This segmentation allows the member to fill gaps of varying sizes effectively, reducing the overall possibility of breakage or chipping of the sapphire panel while maintaining its inherent strength.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If components of varying heights are disposed on the circuit board, then functional requirements are met, but gaps are created that increase breakage risk

Engineering Contradiction:

Improveaccommodation of varying component heightsVSAvoidgap-induced breakage risk

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The gap reduction member features steps with different heights at different locations, creating local variations in the filling structure. Each step is positioned to correspond to components of specific heights, providing localized gap reduction where needed while maintaining overall structural integrity and reducing breakage risk.

Inventive Principle:

Principle #3Local quality

3Reliability

If the number of gaps is reduced, then breakage resistance is improved, but the complexity of the gap reduction member increases

Engineering Contradiction:

Improvebreakage resistanceVSAvoidgap reduction member structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The gap reduction member with multiple steps serves multiple functions simultaneously: it fills gaps of varying heights, provides structural support, and reduces the number of gaps within the housing. This multi-functionality achieves improved breakage resistance without requiring multiple separate components, thereby limiting the increase in overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8988886B1Electronic apparatus

Publication Date: 2015.03.24 KYOCERA CORP

AI summary

An electronic apparatus includes a cover panel and a case, and at least a board disposed therebetween. A plurality of components are disposed on a board and have heights different from one another. A gap reduction member is disposed so as to face the plurality of components. Steps are formed on the gap reduction member in accordance with the heights of the plurality of components which faces the plurality of components to reduce breakage of a cover panel of the electronic apparatus.