Integrated Device Step Heat Sink With EMI Shielding
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Solution Overview
Problem
There is an ongoing need to improve the performance of heat dissipating devices, particularly in integrated devices with electromagnetic interference shielding, to enhance heat dissipation and reduce surface temperature increases.
Innovation Solution
An assembly comprising a substrate with integrated devices, a frame surrounding the devices, a step heat sink, a shield, and a heat pipe, where the step heat sink and shield provide electromagnetic interference shielding while dissipating heat effectively, and the heat pipe aids in phase transition heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional heat sink is used, then heat dissipation is provided, but the surface temperature increases rapidly and EMI shielding is insufficient
Solution Approach 1:
The patent combines the heat sink and EMI shield into a single integrated component. The heat sink includes a base portion coupled to the integrated device and a shield portion extending from the base, forming a unified structure that simultaneously provides thermal management and electromagnetic interference shielding. This merging eliminates the need for separate heat sink and EMI shield components.
Solution Approach 2:
The heat sink is designed to perform multiple functions: it dissipates heat from the integrated device through its thermally conductive structure while simultaneously providing EMI shielding through its electrically conductive shield portion. This multi-functional design addresses both thermal management and electromagnetic compatibility requirements in a single component.
2Temperature
If heat dissipation performance is improved, then junction temperature is reduced, but device complexity increases
Solution Approach 1:
The heat sink is divided into distinct functional portions: a base portion for thermal coupling with the integrated device and a shield portion for EMI protection. This segmentation allows each portion to be optimized for its specific function while maintaining overall integration, reducing complexity compared to using multiple separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly effectively reduces the junction temperature of integrated devices and slows the rate of surface temperature increase, improving comfort and performance by enhancing heat dissipation and spreading heat over a larger area.
Implementation Method 1
a heat pipe coupled to the step heat sink... the heat pipe aids in phase transition heat dissipation
Implementation Method 2
The step heat sink is configured to dissipate heat away from the integrated device
Implementation Method 3
a shield coupled to the frame such that the shield is located between the frame and the step heat sink
Data Source
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AI summary
An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.