Step Molded Inner Stacking Module Package System
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current electronics packaging technologies face challenges in accommodating high-speed computer devices, particularly in cooling and reliability, while struggling to reduce costs and complexity, and meet the demands of next-generation IC package assemblies with increasing clock rates, EMI radiation, thermal loads, and varied environmental needs.
Innovation Solution
The implementation of a step molded inner stacking module system, which includes a substrate, an integrated circuit, an inner stacking module with a molded integral step, and encapsulation, reducing the need for silicon spacers and additional adhesives, and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional packaging structures with silicon spacers and multiple adhesives are used, then structural support and component mounting are achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple separate components (substrate, spacers, adhesives, and mounting structures) into a single integrated packaging structure. The substrate is formed with integrated mounting structures that directly provide both structural support and component mounting functions, eliminating the need for separate spacers and adhesive layers, thus reducing complexity while maintaining reliability
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it provides structural support, serves as a mounting platform for integrated circuits, provides electrical connections, and offers mechanical stability. This multi-functional design eliminates the need for separate dedicated components for each function, reducing overall device complexity
2Ease of manufacture
If multiple components and process steps are used in traditional packaging, then functional requirements are met, but manufacturing cost and production time increase
Solution Approach 1:
The packaging structure is designed as a single integrated substrate component rather than multiple separate parts requiring assembly. This segmentation into one monolithic structure eliminates multiple assembly steps, reduces manufacturing complexity, and improves production efficiency by allowing the entire structure to be manufactured in a single process
Solution Approach 2:
The substrate is pre-formed with all necessary mounting structures, connection points, and structural features integrated during substrate manufacturing. This preliminary integration of all features eliminates the need for subsequent assembly steps, simplifying the manufacturing process and improving productivity
3Adaptability or versatility
If conventional packaging approaches are used, then current device requirements are met, but next-generation high-speed device requirements (cooling, EMI, thermal loads) cannot be adequately addressed
Solution Approach 1:
The patent incorporates three-dimensional mounting structures and vertical interconnects that enable better thermal management pathways. The integrated substrate design allows for vertical heat dissipation paths and multi-layer routing that addresses thermal loads and EMI challenges of next-generation high-speed devices, providing adaptability to future requirements
Data Source
AI summary
An integrated circuit package system including: providing a substrate; mounting an integrated circuit above the substrate; mounting an inner stacking module, having an inner stacking module encapsulation and a molded integral step molded in the inner stacking module encapsulation, above the integrated circuit; and encapsulating the inner stacking module, and the integrated circuit with an encapsulation.