Step-Shaped Carrier for Vertical Optoelectronic Integration
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Solution Overview
Problem
Conventional semiconductor packages can only integrate a single optoelectronic element, limiting the enhancement of data transmission volume or data rate per unit time, and thus restricting the operation and data transmission performance.
Innovation Solution
An electronic package is designed with a step-shaped carrier structure that vertically integrates two optoelectronic elements with optical fiber connection portions, allowing for enhanced data transmission capabilities while maintaining a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single optoelectronic element is integrated in the conventional semiconductor package, then the device complexity is low and ease of manufacture is maintained, but the data transmission volume or data rate per unit time cannot be enhanced
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional vertical arrangement by introducing a step-shaped carrier structure with multiple level layers. The first optoelectronic element is disposed on the first level layer while the second optoelectronic element is disposed on the second level layer, enabling multiple elements to be integrated within a compact footprint without proportionally increasing overall device complexity
Solution Approach 2:
The carrier structure is segmented into multiple level layers with different heights, creating distinct integration zones for different optoelectronic elements. This segmentation allows each element to be positioned and connected independently, facilitating enhanced data transmission capacity while managing structural complexity through modular organization
2Productivity
If multiple optoelectronic elements are integrated to enhance data transmission volume, then the productivity increases, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
By utilizing vertical stacking with the step-shaped carrier structure, the patent achieves multiple optoelectronic element integration without requiring proportional increases in lateral space or manufacturing complexity. The electronic module is electrically connected to both elements through vertical interconnections, streamlining the manufacturing process compared to horizontal expansion approaches
Solution Approach 2:
The electronic module serves multiple functions by being electrically connected to both the first and second optoelectronic elements, enabling it to handle signals from multiple elements simultaneously. This multi-functionality approach allows a single electronic module to support enhanced data transmission rates without requiring proportional increases in supporting infrastructure
3Quantity of substance
If the overall height or volume is maintained compact while integrating multiple optoelectronic elements, then the device density increases, but the manufacturing precision requirements increase
Solution Approach 1:
The step-shaped carrier structure provides distinct level layers at different heights, creating well-defined positioning zones for each optoelectronic element. This vertical separation simplifies positioning requirements compared to lateral placement, as each element has its dedicated elevation level, thereby reducing manufacturing precision challenges while increasing element density
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which a first optoelectronic element having a first optical fiber connection portion is disposed on an electronic module, a second optoelectronic element having a second optical fiber connection portion is disposed on a first level layer of a lower carrying portion of a step-shaped carrier structure, and the electronic module is disposed on a second level layer of the step-shaped carrier structure and the second optoelectronic element having the second optical fiber connection portion, so that the electronic module is electrically connected to the second optoelectronic element having the second optical fiber connection portion. Thereby, two optoelectronic elements having optical fiber connection portions can be easily and vertically integrated, and the second optoelectronic element can be stably carried by the step-shaped carrier structure.