Step-Structured Substrate Patterning to Prevent Photolithography Disconnection
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Solution Overview
Problem
The challenge in manufacturing electronic devices is to improve process yield and mass production efficiency under existing design constraints, particularly in forming pattern layers on substrates with step structures, where overexposure can lead to disconnection issues and reduced production yield.
Innovation Solution
A method involving at least two photolithography processes is employed to form a pattern layer on a substrate with a step structure, using photomasks with specific light-shielding and light-transmitting patterns to ensure accurate patterning across high-level, low-level, and taper surfaces, adjusting exposure conditions to prevent overexposure and maintain pattern integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single photolithography process is used to form a pattern layer on a substrate with step structure, then the manufacturing process is simple, but overexposure occurs leading to disconnection issues and reduced production yield
Solution Approach 1:
The single photolithography process is segmented into multiple photolithography processes. The pattern layer is formed through a first photolithography process and a second photolithography process, where each process uses different exposure conditions and photomask patterns. This segmentation allows precise control of pattern formation on different surface levels (high-level, low-level, and taper surfaces) without overexposure, thereby improving production yield while managing process complexity.
2Manufacturing precision
If exposure conditions are increased to ensure complete pattern coverage on all surfaces, then pattern coverage is improved, but overexposure causes disconnection and reduces yield
Solution Approach 1:
Different exposure conditions are applied to different regions of the substrate. The first photolithography process uses first exposure conditions optimized for certain surfaces, while the second photolithography process uses second exposure conditions optimized for other surfaces. This local quality approach ensures that each region receives appropriate exposure without overexposure, maintaining both pattern formation precision and connection reliability.
Solution Approach 2:
The first photolithography process is performed as a preliminary action before the second photolithography process. The first process forms an initial pattern layer configuration that prepares the substrate for the second process. This preliminary action allows subsequent exposure conditions to be optimized without causing overexposure, as the pattern formation is achieved through cumulative precise exposure rather than excessive single-step exposure.
3Reliability
If multiple photolithography processes are used to achieve precise patterning, then disconnection problems are reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent changes multiple parameters across the two photolithography processes, including exposure conditions, photomask patterns, and processing sequences. These parameter changes enable precise pattern formation that prevents disconnection issues. While the process complexity increases due to multiple steps, the parameter changes are systematically managed to achieve the reliability improvement, with each parameter adjustment serving a specific function in the overall patterning strategy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces disconnection problems and improves production yield by ensuring precise pattern formation, suitable for high-resolution products, and allows for the creation of electronic devices with enhanced reliability and efficiency.
Implementation Method 1
The pattern layer is formed by at least two photolithography processes
Data Source
AI summary
The disclosure provides an electronic device includes a substrate and a pattern layer. The substrate with a step structure includes a high-level surface and a low-level surface. The pattern layer includes a first unit pattern and a second unit pattern adjacent to and separated from the first unit pattern, wherein the first unit pattern overlaps a first part of the low-level surface and overlaps a first part of the high-level surface, and the second unit pattern overlaps a second part of the low-level surface and overlaps a second part of the high-level surface.