Stepped Aligning Plate for High-Density Connector Mounting
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Solution Overview
Problem
Conventional board-mounting connectors face challenges in high-density mounting on circuit boards due to degradation in strength and positioning accuracy, particularly with high-density positioning holes and interference issues with mounting components.
Innovation Solution
A connector design featuring a stepped aligning plate with a convex section on one face and a concave relief section on the opposing face, allowing for improved strength, reduced warping, and enhanced positioning accuracy while accommodating high-density mounting without excessive complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of positioning holes in the aligning plate is increased to achieve high-density mounting, then the positioning capability is improved, but the strength of the aligning plate degrades and warping occurs during molding
Solution Approach 1:
The patent introduces a stepped structure that creates multiple height levels (dimensions) on the aligning plate. The first face has positioning holes at a higher level while the second face has a relief section at a lower level, allowing the plate to accommodate high-density positioning requirements without compromising overall strength, as the stepped design distributes stress more effectively than a flat plate with numerous holes.
Solution Approach 2:
The aligning plate features different structural qualities at different locations: the first face contains positioning holes with specific density for terminal alignment, while the second face has a relief section with reduced material density to prevent interference. This local differentiation allows the plate to optimize both positioning functionality and structural integrity in different regions.
2Manufacturing precision
If the aligning plate is positioned close to the circuit board to improve positioning accuracy, then the positioning precision is improved, but interference occurs with mounting components and solder fillet sections
Solution Approach 1:
The stepped structure creates a vertical dimension separation where the first face (with positioning holes) can be positioned closer to the circuit board for accurate terminal alignment, while the second face (with relief section) remains at a lower level to avoid interfering with mounting components and solder fillet sections. This multi-level design resolves the spatial conflict between positioning precision and component clearance.
Solution Approach 2:
The aligning plate is segmented into two distinct functional faces: the first face dedicated to positioning terminals with high precision holes, and the second face providing clearance space with the relief section. This segmentation allows each face to independently fulfill its function without compromising the other.
3Ease of manufacture
If the aligning plate is designed with a simple flat structure to reduce complexity, then the manufacturing ease is improved, but the ability to accommodate high-density mounting while maintaining strength is reduced
Solution Approach 1:
The stepped structure adds a vertical dimension to the aligning plate design, creating multiple height levels that enable high-density mounting capability while maintaining manufacturability. The stepped configuration can be integrated into the molding process and provides the necessary structural differentiation without requiring complex assembly of multiple parts.
Solution Approach 2:
The patent combines multiple functions into a single aligning plate structure: positioning terminals, providing structural support, and creating clearance space. The stepped design integrates the positioning holes and relief section into one monolithic component, eliminating the need for separate parts while achieving high-density mounting capability.
Data Source
AI summary
A connector includes a housing, a plurality of terminals installed in the housing, and an aligning plate configured to be installed in the housing and having a plurality of positioning holes. The connector is configured to be mounted on a circuit board so that the terminals inserted into the positioning holes are inserted into the through holes of the circuit board. The aligning plate has a first face and a second face on the opposite side of the first face, the second face being opposed to the circuit board during mounting onto the circuit board. The aligning plate has a stepped shape including a plurality of faces being different in position in the mounting direction toward the circuit board on the first face. The aligning plate has a relief section provided on the second face.