Stepped Hollow-Cavity Antenna Substrate for Multi-Layer RF Coupling
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Solution Overview
Problem
Conventional wireless communication modules face signal loss at high frequencies due to the use of high-frequency materials with low dielectric constants, and the stacking of substrates with air medium leads to poor coplanarity and positioning errors, limiting the number of antenna layers and affecting performance.
Innovation Solution
An antenna supporting substrate with a step-shaped hollow cavity and multiple openings, allowing for multi-layer antenna structures with adjustable heights and maintaining coplanarity, using insulating materials like Ajinomoto build-up film or epoxy resin, and an electrical conduction circuit for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If high-frequency materials with low dielectric constant are used, then signal loss is reduced, but material cost increases significantly
Solution Approach 1:
The patent extracts the air medium from the traditional substrate structure and places it between the antenna layer and circuit substrate, eliminating the need for expensive high-frequency materials while maintaining low signal loss characteristics
Solution Approach 2:
The patent uses air as an inert medium between the antenna and circuit substrate, replacing expensive dielectric materials with a naturally low-loss environment that reduces signal attenuation without requiring costly specialized materials
2Reliability
If two substrates are stacked with air medium, then signal transmission is improved, but coplanarity deteriorates due to solder ball tolerance
Solution Approach 1:
The patent introduces a stepped structure that adds vertical dimensionality to the antenna support, allowing the antenna to be positioned at multiple height levels while maintaining horizontal coplanarity with the circuit substrate through precision molding of the support structure
Solution Approach 2:
The patent uses a precision-molded antenna support structure that replicates the exact positioning requirements, transferring the coplanarity constraint from the solder joint interface to the molded support structure where higher precision can be achieved
3Ease of manufacture
If single-layer antenna structure is used, then manufacturing is simplified, but multi-frequency application capability is limited
Solution Approach 1:
The patent segments the antenna support structure into multiple stepped levels, allowing separate antenna elements to be positioned at different heights and configurations, enabling multi-frequency operation while maintaining a single integrated molded structure for simplified manufacturing
Solution Approach 2:
The patent implements a nested stepped structure where multiple antenna elements are positioned at different vertical levels within a single support structure, allowing compact multi-layer antenna integration without requiring separate manufacturing processes
Data Source
AI summary
An antenna module is provided, in which an antenna supporting substrate having a step-shaped hollow cavity is disposed on a circuit structure having an antenna part, so that the antenna part is exposed from the step-shaped hollow cavity, and an antenna structure is arranged on the steps of the step-shaped hollow cavity to cover the antenna part and is electromagnetically coupled with the antenna part, and there is no barrier but an air medium between the antenna structure and the antenna part.