Stepped Base Layout for Laser Light Emitting Wire Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting devices face challenges in facilitating efficient wire bonding between light emitting elements and electronic members due to the complexity of their structural configurations.
Innovation Solution
The device incorporates a base with stepped portions of varying heights, allowing for distinct wiring regions for different components, enabling easier wire connections by positioning bonding points at different elevations to accommodate the varying heights of light emitting elements and electronic members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a flat base structure is used for mounting light emitting elements and electronic members, then the device structure is simple, but wire bonding becomes difficult due to height differences between components
Solution Approach 1:
The base structure transitions from a flat two-dimensional surface to a three-dimensional stepped structure with multiple height levels. This dimensional change allows components at different heights to be mounted on different steps, eliminating the need for excessive wire routing around height obstacles and facilitating direct wire bonding between components at appropriate height levels.
Solution Approach 2:
The base is segmented into multiple stepped portions at different height levels, with each step designed to accommodate specific components. The light emitting element is mounted on a first step while the electronic member is mounted on a second step at a different height, allowing wires to connect them more easily without crossing optical paths or requiring complex routing.
2Ease of manufacture
If components are mounted at different heights to facilitate wire bonding, then wire bonding is easier, but the base structure becomes more complex
Solution Approach 1:
Different regions of the base are given different height levels (local qualities) to match the specific mounting requirements of different components. The stepped portions are localized to where components need to be mounted at specific heights, rather than making the entire base complex. This allows easy wire bonding in local areas while maintaining overall structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the wire bonding process, enhancing connectivity and reducing potential interference with optical paths, while maintaining a hermetically sealed environment for the semiconductor laser elements.
Implementation Method 1
A light emitting element is disposed on the bottom face. An electronic member is disposed on the bottom face and configured to be irradiated by light emitted from the light emitting element.
Data Source
AI summary
A base includes: a bottom part having a bottom face, wherein the bottom face has a first region configured to support one or more semiconductor laser elements thereon and a second region configured to support a light reflective member and/or an optical member thereon; a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part has an uppermost face and includes a first stepped portion including a first upper face and a second stepped portion including a second upper face, wherein the first stepped portion faces the second stepped portion, and wherein the first upper face and the second upper face are disposed below the uppermost face; and one or more first metal films located on the first upper face of the first stepped portion.