Stepped Processing Chamber Layout for Uniform Substrate Edge Patterns

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Solution Overview

Problem

Existing substrate processing methods using supercritical fluids face issues with non-uniformity and leaning phenomena of fine patterns at the substrate edge due to high-pressure fluid turbulence.

Innovation Solution

The substrate processing apparatus incorporates a processing chamber design with a step portion and a round portion on its upper surface, aligning the step portion vertically with the substrate edge, and utilizing multiple fluid supply pipes to control fluid flow and reduce turbulence, thereby improving uniformity and preventing pattern leaning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If high-pressure fluid is supplied to the substrate processing chamber, then the processing efficiency is improved, but fluid turbulence occurs causing non-uniform processing and pattern leaning at the substrate edge

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidpattern uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The processing chamber upper surface is divided into multiple regions with different heights, creating step portions at specific locations. This segmentation allows different areas of the substrate to experience different fluid flow conditions, with the step portions acting as flow control elements that reduce turbulence in critical regions while maintaining overall processing efficiency

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The step portions are strategically positioned at specific distances from the chamber center (first distance greater than second distance) to create localized flow control zones. This local quality modification ensures that turbulence is reduced specifically at the substrate edge regions where pattern leaning occurs, while maintaining efficient processing in other areas

Inventive Principle:
Principle #3Local quality

2Device complexity

If the processing chamber has a simple flat upper surface, then the device complexity is reduced, but fluid turbulence causes leaning phenomenon of fine patterns at substrate edge

Engineering Contradiction:
Improvechamber structure simplicityVSAvoidpattern uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

Round portions are added to the processing chamber upper surface at specific locations. These curved geometric features help to smooth fluid flow paths and reduce turbulence by eliminating sharp corners and edges that would otherwise create flow separation and eddies, thereby preventing pattern leaning while adding minimal structural complexity

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The processing chamber upper surface is modified by adding vertical height variations through step portions, transitioning from a two-dimensional flat surface to a three-dimensional stepped surface. This dimensional change creates flow control functionality without requiring additional separate components, maintaining relative structural simplicity while effectively reducing turbulence

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces fluid flow rate and turbulence, enhancing the uniformity of substrate processing and increasing production yield by minimizing the leaning phenomenon of fine patterns at the substrate edge.

Implementation Method 1

supplying a processing fluid into the processing chamber

Methodology Applied
Scientific EffectFluid flow:

Implementation Method 2

high-pressure fluid turbulence

Methodology Applied
Scientific EffectTurbulence: Turbulence

Data Source

PatentUS20250232986A1Substrate processing apparatus and substrate processing method
Publication Date: 2025.07.17 SAMSUNG ELECTRONICS CO LTD
  • US20250232986A1 patent drawing
  • US20250232986A1 patent drawing
  • US20250232986A1 patent drawing

AI summary

A substrate processing apparatus includes a processing chamber including a processing space, a substrate support that receives a substrate and support the substrate in the processing chamber, a fluid supply pipe arranged at a lower portion of the processing chamber, and a fluid supply device that supplies a processing fluid to the processing space through the fluid supply pipe. The processing chamber includes a step portion and a round portion both in an upper surface that defines the processing space, and a first horizontal separation distance from a center of the processing chamber to the step portion is greater than a second horizontal separation distance from the center of the processing chamber to an edge of the substrate.