Stepped-Back Chip Package Cavity Layout for Smaller Footprints
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is an ongoing need for packages with substrates and integrated devices that offer improved performance while being compact, small, and thin, and also require a reduction in overall package size.
Innovation Solution
The package comprises a first substrate with an integrated device having a step back side, a second substrate with a cavity that partially houses the integrated device, and an encapsulation layer between the substrates, which is also partially located in the cavity of the second substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If the integrated device is placed entirely on the first substrate without a cavity, then the package structure is simpler, but the package size cannot be reduced and thermal performance is limited
Solution Approach 1:
The integrated device is partially nested within the cavity of the second substrate, with the step back side allowing the device to extend into the cavity space. This nesting arrangement reduces the overall package volume by utilizing the cavity space that would otherwise be empty, while maintaining a manageable structural complexity through the organized multi-substrate configuration.
Solution Approach 2:
The step back side of the integrated device introduces a dimensional change by creating a stepped profile that allows the device to occupy both the surface plane and the cavity depth. This dimensional transition enables more efficient space utilization in the vertical dimension, reducing the horizontal footprint and overall package size without requiring complex lateral arrangements.
2Adaptability or versatility
If the cavity in the second substrate is made larger to accommodate the integrated device, then the device can be better integrated, but the package size increases and fewer interconnects can be placed
Solution Approach 1:
The cavity is designed with non-uniform dimensions, being larger in specific regions to accommodate the integrated device's step back side while maintaining smaller dimensions in other areas. This localized sizing allows the cavity to provide necessary accommodation for the device without unnecessarily increasing the overall package volume, and leaves sufficient space in the substrate for placing additional interconnects.
3Temperature
If the cavity size is increased to improve thermal performance, then heat dissipation may be improved, but the package size increases
Solution Approach 1:
The integrated device is nested within the cavity, allowing the cavity to serve as a thermal management structure. The cavity provides pathways for thermal conduction and convection while maintaining a compact footprint, as the device itself occupies the cavity space rather than requiring additional external volume for thermal management features.
Data Source
AI summary
A package comprising a first substrate; an integrated device coupled to the first substrate, wherein the integrated device comprises a step back side; a second substrate comprising a cavity, wherein the integrated device is located at least partially in the cavity of the second substrate; and an encapsulation layer coupled to the first substrate and the second substrate. The encapsulation layer is located between the first substrate and the second substrate. The encapsulation layer is located at least partially in the cavity of the second substrate.