Stepped Circuit Board for Power Module Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional on-board high-power DC/DC power modules face challenges in heat dissipation due to the complexity of designing stepped heat dissipation structures for components of different heights, leading to increased design cycles and production complexity, while also requiring improved power density and efficiency.
Innovation Solution
The module optimizes the circuit board by forming planes of different heights to create a unified surface for heat dissipation devices, simplifying assembly and reducing the size of the heat dissipation device, thereby enhancing heat dissipation capability and power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a stepped heat dissipation structure is designed to accommodate components of different heights, then heat dissipation effectiveness is improved, but device complexity and design cycles increase
Solution Approach 1:
The patent introduces a third dimension (vertical height) to the circuit board by creating stepped planes at different heights. This allows components of different heights to be accommodated on the same board without requiring complex stepped heat dissipation structures, as each component contacts the heat dissipation device at its appropriate height level through the stepped board surface.
2Adaptability or versatility
If components of different heights are disposed on the circuit board, then functional requirements are met, but the heat dissipation device requires a stepped structure increasing production complexity
Solution Approach 1:
The circuit board is segmented into multiple stepped planes at different heights. This segmentation allows each plane to support components of specific height ranges, simplifying the overall assembly process and eliminating the need for complex stepped heat dissipation structures while maintaining flexibility in component arrangement.
3Power
If the module volume is reduced to increase power density, then power density is improved, but heat dissipation capability becomes more challenging
Solution Approach 1:
By utilizing vertical height differences through stepped planes on the circuit board, the patent enables efficient heat dissipation in a compact volume. Components are positioned at different heights to optimize thermal contact with the heat dissipation device, allowing effective heat management without increasing module volume.
Data Source
AI summary
The present disclosure provides a module including a circuit board, a first component and a second component. The circuit board includes a first side and a second side opposite to each other and includes a first plane and second plane disposed on the first side. A first height difference is formed between the first plane and the second plane. The first component and the second component are disposed on the first plane and the second plane, respectively. The first component and the second component include a first contact surface and a second contact surface, respectively. The first contact surface and the second contact surface are coplanar with a first surface of the module. It benefits to reduce the design complexity of a heat-transfer component, and enhance the heat dissipation capability and the overall power density of the module simultaneously.