High-Resolution Display Bonding With Stepped Connection Lines
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Solution Overview
Problem
Conventional display apparatuses face challenges in accurately bonding pads on flexible printed circuit boards with display panels due to the high resolution, leading to misalignment and potential short circuits.
Innovation Solution
A display apparatus design featuring a connection line with a specific height configuration and laser beam processing to form openings in integration pads, ensuring precise alignment and integration of flexible printed circuit boards with display panels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high resolution is implemented in display apparatus, then image quality is improved, but alignment precision between pads on flexible printed circuit board and display panel deteriorates
Solution Approach 1:
The patent introduces a flexible printed circuit board with a specific structure including a first pad, second pad, and connection line as an intermediary component between the display panel and external circuits. The connection line with greater height than the pads creates a stepped structure that facilitates accurate alignment and bonding, resolving the alignment precision issue while maintaining high image resolution
Solution Approach 2:
The patent solves the alignment problem by transitioning from a two-dimensional pad-to-pad bonding approach to a three-dimensional stepped structure. The connection line extends upward with greater height than the pads, creating vertical dimension differentiation that enables more tolerant and precise alignment during the bonding process, thus maintaining both high resolution and manufacturing precision
2Measurement precision
If pad size is decreased for high resolution, then image quality is improved, but bonding accuracy between pads deteriorates
Solution Approach 1:
The patent compensates for the reduced pad size by introducing vertical dimension differentiation. The connection line has a greater height than the pads, creating a stepped structure where the higher connection line serves as a more prominent alignment feature during bonding, thus maintaining bonding accuracy even as pad dimensions decrease for higher resolution
Solution Approach 2:
The patent applies different structural characteristics to different parts of the flexible printed circuit board. The connection line is designed with greater height than the pads, creating local structural differentiation. This localized height variation provides enhanced alignment features specifically at the connection line region, ensuring bonding accuracy is maintained despite overall pad size reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate electrical connection of high-resolution display apparatuses, preventing misalignment and short circuits while allowing for high-resolution image implementation.
Implementation Method 1
forming, by radiating a laser beam onto the first integration pad, a first opening and a second opening through the first integration pad
Data Source
AI summary
A display apparatus includes: a substrate including a display region and a non-display region outside the display region; a first line disposed on an upper surface of the substrate in the non-display region of the substrate, where the first line has a first height; a flexible printed circuit board; a second line disposed on a lower surface of the flexible printed circuit board, where the second line has a second height; and a connection line located in a portion in which the substrate and the flexible printed circuit board overlap each other and disposed between the substrate and the flexible printed circuit board, where in the connection lines has a third height greater than each of the first height and the second height, one end of the connection line is connected to the first line, and another end of the connection line is connected to the second line.