Stepped Dividing Plates for Electronic Device Cooling
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Solution Overview
Problem
Existing electronic devices with cooling systems using fans and air vents face inefficiencies in airflow distribution, leading to suboptimal cooling of electronic modules, particularly hard disk drives, due to the conventional arrangement of dividing plates which can restrict airflow and hinder effective heat dissipation.
Innovation Solution
The electronic device incorporates a unique arrangement of dividing plates within the chassis, where the plates are stepped down from the front to the rear, creating varying spaces for airflow paths that enhance the flow of cooling air through and out of the modules, preventing preheated air recirculation and improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional dividing plates are used to arrange electronic modules in rows, then the device structure is simple and modules are orderly arranged, but the airflow is restricted and cooling efficiency deteriorates
Solution Approach 1:
The patent transitions from conventional horizontal row arrangement to a stepped vertical arrangement where dividing plates are positioned at different heights from front to rear. This dimensional change creates multiple airflow channels and prevents air recirculation, significantly improving cooling efficiency while maintaining manufacturing simplicity
Solution Approach 2:
The chassis is segmented into multiple cooling zones by dividing plates positioned at different heights. Each zone creates independent airflow paths, allowing optimized cooling for different module positions without complicating the overall manufacturing process
2Temperature
If dividing plates are arranged to create varying spaces for airflow, then cooling efficiency is improved, but the device structure becomes more complex
Solution Approach 1:
The dividing plates are positioned asymmetrically at different heights from front to rear rather than uniformly. This asymmetric arrangement optimizes airflow paths and prevents recirculation while maintaining a relatively simple overall structure that does not require complex manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement increases airflow through and out of the electronic modules, enhancing the cooling effect and improving the overall thermal management of the device by optimizing airflow paths and preventing heat recirculation.
Implementation Method 1
creating varying spaces for airflow paths that enhance the flow of cooling air through and out of the modules, preventing preheated air recirculation
Implementation Method 2
enhancing the cooling effect and improving the overall thermal management of the device by optimizing airflow paths
Data Source
AI summary
An electronic device includes a chassis and a plurality of electronic modules. The chassis includes a front plate, a rear plate, a top plate, two side plates, a bottom plate and a plurality of dividing plates. The electronic modules are set between two adjacent dividing plates. The front plate includes an air inlet defined in a bottom. A first space is defined between a bottom of each dividing plate and the bottom plate. A second space is defined between a top of each dividing plate and the top plate. At least one of the top of the dividing plate and the bottom of the dividing plate is arranged stepped down from the front plate to the rear plate. The airflow flows through the air inlet, the first space, then flows up through the electronic modules, and then flows to the rear plate.