Stepped Electrode Cover Layer for Adhesion
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Solution Overview
Problem
Existing electronic components face issues with electrode separation due to weak adhesion between insulating layers and electrodes, particularly when the electrode area is small, and uneven stress distribution caused by varying insulating layer thickness.
Innovation Solution
The electronic component features a cover layer with insulating properties extending across the boundary between the electrode periphery and the electronic component body, with a step design where the lower electrode extends more outward than the upper electrode, enhancing adhesion and rigidity, thereby preventing electrode separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating layer is applied to cover the electrode periphery, then electrode separation is prevented, but the adhesion between the insulating layer and electrode becomes weak when the electrode area is small
Solution Approach 1:
The patent transitions from a single-layer insulating structure to a multi-layer cover structure with different thickness zones. The first cover layer has uniform thickness across the electrode, while the second cover layer extends beyond the electrode periphery with greater thickness, creating a stepped configuration that improves adhesion through increased surface area and mechanical interlocking.
Solution Approach 2:
The patent applies different thickness characteristics of the cover layer to different regions: the first cover layer maintains uniform thickness for electrical performance, while the second cover layer has increased thickness at the electrode periphery to enhance adhesion and mechanical strength where it is most needed.
2Area of stationary object
If the insulating layer thickness varies to cover the electrode periphery, then coverage is improved, but the rigidity of the insulating layer varies causing uneven stress distribution
Solution Approach 1:
The patent divides the cover layer into two distinct segments: the first cover layer with uniform thickness that maintains consistent rigidity and stress distribution, and the second cover layer with greater thickness that extends beyond the electrode periphery to provide enhanced coverage and adhesion without compromising the structural stability of the main electrode area.
3Reliability
If the cover layer extends across the boundary between electrode periphery and electronic component body, then electrode separation is prevented, but the manufacturing complexity increases
Solution Approach 1:
The patent controls the thickness parameter of the cover layer to create a stepped structure where the first cover layer has uniform thickness and the second cover layer has greater thickness extending beyond the electrode. This parameter variation achieves comprehensive coverage and separation prevention while maintaining manufacturability through conventional ceramic processing techniques.
Data Source
AI summary
An electronic component including: an electronic component body; at least one electrode on a surface of the electronic component body; and a cover layer having insulating properties on at least a part of a periphery of the electrode and extending across a boundary between the periphery of the electrode and the surface of the electronic component body, wherein the electrode includes, on the at least part of the periphery, a lower electrode closer to the surface of the electronic component body and an upper electrode on the lower electrode, the lower electrode extends more outward than the upper electrode to create a step at the at least part of the periphery of the electrode, and at the step at the periphery of the electrode, the cover layer extends from a surface of the upper electrode to a portion with no electrodes on the surface of the electronic component body.