Stepped Electrode Structure for Solder Adhesion and Short Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic components face challenges in achieving both high adhesion strength between electrodes and preventing short-circuiting between adjacent electrodes without increasing profile complexity.
Innovation Solution
The electronic component features a first electrode with a central portion of one thickness and a peripheral portion of another, smaller thickness, covered by a plated film with higher solder affinity, and isolated by a resist film, allowing for enhanced adhesion and reduced short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a resist film is arranged to cover a peripheral portion of an electrode (SMD structure), then adhesion strength between the electrode and substrate is enhanced, but the ability to prevent short-circuiting between adjacent electrodes is low
Solution Approach 1:
The electrode is divided into a land portion (peripheral) and a connection portion (central), with the resist film selectively covering only the land portion. This segmentation allows the land portion to provide adhesion while the connection portion remains exposed for soldering and short-circuit prevention.
Solution Approach 2:
The resist film is applied locally to specific regions (land portions) rather than uniformly across the entire electrode. This local quality approach ensures that adhesion is enhanced where needed (at the periphery) while maintaining solder accessibility and short-circuit prevention at the connection portions.
2Reliability
If a resist film is arranged at a distance from an electrode (NSMD structure), then the ability to prevent short-circuiting between adjacent electrodes is high, but adhesion strength between the electrode and substrate remains low
Solution Approach 1:
The electrode structure is segmented into land portions covered by resist film and connection portions remaining exposed. This segmentation enables the land portions to provide adhesion strength while the exposed connection portions maintain spacing for short-circuit prevention.
Solution Approach 2:
The solution transitions from a two-dimensional planar arrangement (either SMD or NSMD) to a three-dimensional structure where the electrode has varying thickness (first thickness at land portions, second thickness at connection portions), allowing simultaneous achievement of adhesion and short-circuit prevention.
3Reliability
If hollow electrodes are provided on the electrode terminals or on the electrodes of the semiconductor element, then adhesion and short-circuit prevention can be achieved, but a large number of steps should be performed and profile reduction is disadvantaged
Solution Approach 1:
The electrode structure integrates multiple functions into a single component: the land portions provide adhesion, the connection portions enable soldering, and the varying thickness provides mechanical support. This merging eliminates the need for separate hollow electrodes and complex multi-step manufacturing processes.
Solution Approach 2:
The electrode structure serves multiple functions simultaneously: it provides adhesion to the substrate, enables electrical connection through soldering, and prevents short-circuits between adjacent electrodes. This multi-functionality replaces the need for separate specialized components like hollow electrodes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures strong adhesion while preventing short-circuits without increasing profile complexity, facilitating soldering and maintaining conductivity.
Implementation Method 1
a plated film where a film made of a second material higher in affinity for solder than the first material is exposed at an outermost surface
Data Source
AI summary
An electronic component includes a main body including a first surface, a first electrode and a second electrode arranged on the first surface, and a resist film arranged to isolate the first electrode from the second electrode. The first electrode and the second electrode are mainly composed of a first material. The first electrode includes a first portion including a central portion and having a first thickness and a second portion having a second thickness smaller than the first thickness in at least a part of a peripheral portion. The first portion is covered with a plated film where a film made of a second material higher in affinity for solder than the first material is exposed at an outermost surface. At least a part of the second portion is covered with the resist film. The first portion is distant from the resist film.