Stepped Component-Embedded Structure for Wafer Warpage Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Warping of wafers or panels during production due to chemical shrinkage and thermal expansion coefficient differences in embedded materials, leading to poor production yield and increased costs, along with insufficient thermal conductivity in the vertical direction.
Innovation Solution
A component-embedded structure with stepped metal walls and insulating material to suppress warpage deformation and improve vertical heat dissipation, utilizing a design where the metal content is higher in certain regions to counteract thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If embedded materials are used to improve electrical characteristics and reduce wire length, then component integration is improved, but warpage deformation occurs due to chemical shrinkage and thermal expansion coefficient differences
Solution Approach 1:
The patent changes the physical parameters of the embedded structure by creating a stepped configuration with varying heights. The first embedded structure has a first height and the second embedded structure has a second height different from the first, allowing different regions to accommodate different thermal expansion characteristics and chemical shrinkage rates, thereby reducing overall wafer warpage while maintaining component integration benefits
Solution Approach 2:
The patent segments the embedded structure into multiple regions with different heights. By dividing the embedding area into a first embedded structure region and a second embedded structure region with different vertical dimensions, the structure can better manage localized stress and deformation, reducing warpage while still providing effective component embedding
2Volume of moving object
If embedded materials are used to reduce overall product size, then miniaturization is achieved, but thermal conductivity in the vertical direction becomes insufficient
Solution Approach 1:
The patent applies local quality by creating regions with different embedded structure heights. The first embedded structure has a first height and the second embedded structure has a second height, allowing specific areas to be optimized for thermal management. This stepped configuration enables better vertical heat dissipation pathways in regions where thermal conductivity is critical, while maintaining compact overall dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces warpage deformation and enhances vertical heat dissipation, improving production yield and feasibility of high-density applications.
Implementation Method 1
warping of the wafer or panel during the production process can result in a poor production yield and increased costs. Insufficient thermal conductivity of the embedded material in the vertical direction is also a disadvantage.
Implementation Method 2
Insufficient thermal conductivity of the embedded material in the vertical direction is also a disadvantage.
Data Source
AI summary
A component-embedded structure for warpage suppression is provided. The component-embedded structure includes a first frame, a second frame, at least one component and an insulating material. The second frame is disposed within the first frame. The component is disposed within the second frame. The height of the first frame is higher than that of the second frame. The insulating material is filled between the first frame and the second frame, and between the second frame and the component.