Stepped Heat Sink PCB Module for Miniaturized Electronics
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Solution Overview
Problem
In miniaturized electronic devices, the challenge is to enhance heat dissipation efficiency while securing sufficient space for component placement within the housing, which is complicated by the generation of electrical noise and the limited space available.
Innovation Solution
A printed circuit board module is designed with a printed circuit board featuring a hole, a heat dissipation member (heat sink) with a stepped surface, and an electronic component placed on the lower surface of the heat sink. The heat sink has a protrusion that fits into the hole, allowing for reduced vertical space usage and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are placed in the housing to achieve miniaturization, then the device size is reduced, but the available space for component placement is limited and electrical noise is generated between multiple components
Solution Approach 1:
The heat dissipation member is designed with a stepped surface that extends in the vertical dimension (upward direction) rather than only in the horizontal plane. This vertical extension allows the heat dissipation member to occupy less horizontal space while providing sufficient heat dissipation area, thereby resolving the contradiction between device miniaturization and available space for components.
2Temperature
If heat dissipation structures are added to the printed circuit board, then heat dissipation efficiency is improved, but the vertical space required for component placement is reduced
Solution Approach 1:
The heat dissipation member utilizes the vertical dimension by extending upward from the printed circuit board surface. This allows the heat dissipation function to be achieved without consuming horizontal space that would be needed for component placement, effectively resolving the contradiction between heat dissipation efficiency and vertical space availability.
Solution Approach 2:
The heat dissipation member is divided into multiple steps or levels, with each step providing a portion of the total heat dissipation area. This segmentation allows the heat dissipation function to be distributed across multiple levels, increasing the effective heat dissipation area without proportionally increasing the vertical height, thus preserving space for components.
3Temperature
If the heat dissipation member is designed with a stepped surface, then heat dissipation area is increased, but the manufacturing complexity is increased
Solution Approach 1:
The heat dissipation member is formed from a single piece of material with a stepped surface configuration. By carefully designing the step dimensions and heights as standard manufacturing parameters, the complex stepped geometry can be achieved through conventional molding or machining processes without requiring multiple assembly steps, thus balancing increased heat dissipation area with acceptable manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the vertical space required for electronic components, thereby increasing the available space within the housing, while also enhancing heat dissipation efficiency by utilizing the stepped surface of the heat sink.
Implementation Method 1
a heat dissipation member (heat sink) disposed on the printed circuit board
Implementation Method 2
facilitating heat dissipation of the drive heat of the electronic component
Data Source
AI summary
The present invention relates to a printed circuit board module and an electronic device including the same. A printed circuit board module according to one aspect includes: a printed circuit board including a hole; a heat dissipation member disposed on the printed circuit board and comprising a first surface formed on an upper surface and a second surface disposed stepwise downwardly with respect to the first surface; and an electronic component disposed on the second surface, wherein a region corresponding to the formed region of the second surface on a lower surface of the heat dissipation member is disposed with a protrusion protruding downwardly from the other region and coupled to the hole. [Representative Drawing] FIG. 1