Stepped Integrated Heat Spreader Cavity for Chip Heat Dissipation
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Solution Overview
Problem
Existing heat spreaders face challenges in optimizing the shape and size of cavities to effectively engage with chips, leading to inefficiencies in heat transfer and potential localized damage due to uneven heat distribution.
Innovation Solution
A heat spreader design featuring a cavity with multiple steps, formed through a half-shearing process, which maximizes depth without increasing the overall thickness, allowing for efficient heat transfer and distribution while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cavity depth is increased to improve heat transfer efficiency, then heat transfer efficiency is improved, but the overall thickness of the heat spreader increases
Solution Approach 1:
The cavity is divided into multiple stepped levels rather than a single deep cavity. This segmentation allows the heat spreader to achieve effective heat transfer engagement with the chip while maintaining a smaller overall thickness by distributing the heat transfer function across multiple levels.
Solution Approach 2:
Instead of increasing depth in one dimension, the solution uses multiple stepped levels that engage with the chip in a distributed manner, effectively utilizing horizontal spacing and vertical tiering to achieve the same heat transfer objective without proportionally increasing overall thickness.
2Reliability
If the cavity shape is optimized to match the chip shape, then heat transfer efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The complex chip-matching cavity shape is achieved through multiple stamped steps rather than a single complex form. Each step can be formed by relatively simple stamping operations, and the combination of steps creates the overall optimized shape that matches the chip footprint.
Solution Approach 2:
The multi-step cavity structure is pre-formed during the stamping process to match the chip shape before assembly. This preliminary shaping ensures optimal heat transfer engagement is built into the structure itself, eliminating the need for additional complex machining or forming operations later.
3Reliability
If the cavity depth is increased to prevent localized damage, then heat distribution is improved, but the structural integrity may be compromised
Solution Approach 1:
The heat distribution function is segmented across multiple stepped levels rather than concentrated in a single deep cavity. This distributes the thermal engagement points, improving heat distribution while maintaining structural integrity because no single point bears excessive mechanical or thermal stress.
Solution Approach 2:
Each step of the cavity can be optimized with local structural features tailored to its specific function in the heat distribution pathway. This allows different regions of the cavity to have appropriate wall thicknesses and support structures, maintaining overall structural integrity while achieving effective heat distribution across the chip interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-step cavity design enhances heat transfer efficiency and prevents localized damage by optimizing the shape and size of the heat spreader to match the chip, ensuring effective heat dissipation and structural stability.
Implementation Method 1
heat generated by the chip 12 is discharged to the heat sink 18 via the heat spreader 20
Implementation Method 2
the punching force causes cold flow of the material from areas of high pressure into areas of lower pressure
Data Source
AI summary
A heat spreader includes a top surface opposite a bottom surface, a cavity extending from the bottom surface, the cavity defined by a profile having at least two steps such that the cavity includes a first surface spaced from the bottom surface of the cavity by a first distance, a second surface spaced from the bottom surface of the cavity by a second distance, and the first distance being less than the second distance. The heat spreader further includes a lid defined by a thickness extending between the bottom surface of the cavity and the top surface of the heat spreader.