Stepped Integrated Heat Spreader for Damage-Free Stacking
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Solution Overview
Problem
Existing heat spreaders face challenges in efficiently dispersing heat across the chip and heat sink while maintaining structural integrity during manufacturing and transportation, particularly due to material deformation and potential damage from stacking.
Innovation Solution
The heat spreader design features a cavity with an inner wall and outer periphery, including steps at the corners that allow for precise engagement and reduced contact points during stacking, formed through a stamping process that maintains constant thickness and geometry, preventing material deformation and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the heat spreader includes a cavity for receiving the chip, then the engagement with the chip is optimized, but the material deformation and damage occur during stacking and transportation
Solution Approach 1:
The cavity surface is segmented into multiple contact points rather than a continuous surface. The steps create discrete engagement zones that reduce the contact area between stacked heat spreaders, minimizing material deformation while maintaining chip engagement functionality
Solution Approach 2:
The steps create vertical dimension variations within the cavity, forming inclined surfaces that redirect contact forces. This dimensional change transforms the stacking interaction from direct surface-to-surface contact to point-based contact at the step locations, reducing damage risk
2Shape
If the cavity is formed by punching material, then the desired shape is achieved, but cold flow deformation occurs during the stamping process
Solution Approach 1:
The stamping process is designed to form the steps and inclined surfaces in a controlled sequence, preparing the material structure before final cavity formation. This preliminary structuring guides material flow during subsequent forming operations, preventing unwanted cold flow deformation
Solution Approach 2:
The stamping parameters are optimized to control material behavior during forming. By adjusting pressure, velocity, and tooling geometry, the process achieves the desired cavity shape while minimizing cold flow effects through controlled plastic deformation
3Device complexity
If the heat spreader surfaces contact directly during stacking, then the structure is simple, but damage occurs to sensitive surfaces
Solution Approach 1:
The steps act as intermediary elements between the outer periphery and the cavity inner surface. During stacking, these steps serve as the contact interface, mediating the interaction between heat spreaders and preventing direct contact between sensitive surfaces that would cause damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat transfer efficiency while minimizing material deformation and damage during handling and transportation by allowing for precise stacking without direct contact between sensitive surfaces, thus maintaining performance and structural integrity.
Implementation Method 1
the punching force causes cold flow of the material from areas of high pressure into areas of lower pressure
Implementation Method 2
heat generated by the chip 12 is discharged to the heat sink 18 via the heat spreader 20
Data Source
AI summary
A heat spreader including a top surface opposite a bottom surface, a cavity formed within and extending upwardly from the bottom surface, wherein the cavity includes an inner wall extending around the cavity and extending vertically downward from an inner cavity surface of the cavity. The heat spreader further includes an outer periphery extending vertically upward from the bottom surface of the heat spreader and extending around the cavity, and at least one step disposed within the cavity an having a surface that is positioned at a vertical height lower than a vertical height of the inner cavity surface of the cavity.