Stepped Image Sensor Module Layout for Compact Camera Packaging
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Solution Overview
Problem
The miniaturization of camera modules is hindered by the space occupied by image sensors and bonding wires, which increases the overall size of the module due to the mounting of sensors on substrates and the installation space required for electrical connections.
Innovation Solution
The design includes a substrate with a step portion and an accommodation portion for the image sensor, where the bonding wire is covered by a bonding portion, and an IR cut-off filter is integrated in a sub-housing, reducing the optical axis distance between the image sensor and the IR cut-off filter, and using a reinforcing plate for enhanced rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the image sensor is mounted on the upper surface of the substrate using a bonding wire, then the image sensor can be electrically connected to the substrate, but the overall size of the camera module increases due to the space occupied by the image sensor and the bonding wire installation space
Solution Approach 1:
The patent introduces a step portion that creates a vertical dimension change on the substrate surface. The image sensor is mounted on the upper surface while the bonding wire is routed through a lower level created by the step portion. This dimensional separation allows electrical connection functionality while reducing the horizontal space occupied by bonding wires, thereby minimizing the overall camera module size.
Solution Approach 2:
The substrate surface is segmented into different levels through the step portion. The upper surface accommodates the image sensor while the lower level (formed by the step portion) accommodates the bonding wire routing. This segmentation separates the functions of sensor mounting and wire routing into distinct spatial zones, reducing interference and space requirements.
2Reliability
If the bonding wire is exposed without coverage, then the electrical connection is established, but the bonding pads and wires are vulnerable to damage and external interference
Solution Approach 1:
The patent introduces a bonding portion as an intermediary protective layer that covers the bonding wire and bonding pads. This bonding portion serves as a mediator that maintains the electrical connection functionality while providing mechanical protection and shielding against external interference, dust, and moisture to the vulnerable bonding components.
Solution Approach 2:
The bonding portion is applied in advance to cover and protect the bonding wire and bonding pads before they are exposed to operational conditions. This protective layer provides beforehand cushioning against potential damage from mechanical stress, environmental factors, and external interference.
3Reliability
If the IR cut-off filter is positioned at a greater distance from the image sensor along the optical axis, then the filter can be effectively integrated, but the overall height of the module increases
Solution Approach 1:
The patent utilizes the vertical step portion to position the IR cut-off filter at a laterally offset position rather than directly along the optical axis. This dimensional change allows the filter to be effectively integrated into the optical path while maintaining a compact overall height, as the filter is positioned in the horizontal plane created by the step portion rather than extending the optical axis distance.
Data Source
AI summary
An image sensor module includes an image sensor and a substrate on which the image sensor is disposed, wherein a step portion is provided on an upper surface of the substrate, an accommodation portion in which the image sensor is disposed is provided at the step portion, the image sensor is connected to the substrate by a bonding wire, and the bonding wire is covered with a bonding portion.