Stepped Inner Lead Semiconductor Device Miniaturization
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Solution Overview
Problem
Conventional semiconductor devices require additional molds and complex processes for miniaturization, leading to increased costs and reduced productivity due to the need for customized molds for each device configuration, especially when trying to minimize the layout area on control substrates.
Innovation Solution
A semiconductor device manufacturing method that includes a lead frame with a stepped inner lead and bent outer lead, allowing for miniaturization by exposing inner lead surfaces from the sealing resin and bending outer leads at the resin's side surfaces, reducing the need for customized molds and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the lead is made to protrude vertically from the sealing resin to miniaturize the device, then the layout area is reduced, but it requires preparing a mold with a slit in the sealing step
Solution Approach 1:
The lead is formed with a predetermined bent shape before the sealing process. The outer lead is pre-bent at a first bend position to extend along the side surface of the sealing resin, and the inner lead is pre-bent at a second bend position. This preliminary formation of the bent shape eliminates the need for mold slits during sealing, as the lead naturally conforms to the desired configuration without requiring special mold modifications.
2Adaptability or versatility
If customized molds are prepared for each semiconductor device specification, then the device can be adapted to different configurations, but the manufacturing complexity and cost increase
Solution Approach 1:
The lead frame structure is designed with universal adaptability through its bent configuration. The outer lead extends along the side surface of the sealing resin at a first bend position, while the inner lead has a second bend position, creating a versatile structure that can accommodate different device specifications without requiring customized molds. This standardized bent lead design can be applied across various semiconductor device configurations, eliminating the need for specification-specific mold variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the miniaturization of semiconductor devices, reduces the layout area on control substrates, and enhances productivity by eliminating the need for slitted molds and simplifying the manufacturing process, resulting in a more efficient and cost-effective production method.
Implementation Method 1
a plating step of plating the outer lead, the exposed surface of the inner lead exposed from the sealing resin, and the framework
Data Source
AI summary
Inner leads having die pads having upper surfaces to which semiconductor elements are mounted each have a stepped profile, and surfaces of portions of the inner leads are exposed from a sealing resin in plan view. Outer leads connected to the inner leads have first bends at side surfaces of the sealing resin to extend in a direction on a side of the upper surfaces of the die pads, so that a miniaturized semiconductor device can be obtained.