Stepped Land Substrate for LED Bonding Strength
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Solution Overview
Problem
Semiconductor devices with light emitting devices mounted on land patterns on a substrate often lack sufficient bonding strength between the light emitting device and the land pattern.
Innovation Solution
A semiconductor device design featuring a mounting substrate with lands having a first surface and a second surface higher than the first surface, where a bonding member is disposed on the second surface to bond the external connecting terminal and the land, enhancing the bonding strength between the light emitting device and the land.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a light emitting device is mounted on a land pattern on a mounting substrate, then the device can be assembled, but sufficient bonding strength between the light emitting device and the land pattern cannot be obtained
Solution Approach 1:
The land pattern is designed with a stepped structure having a first surface and a second surface at a different height level. The bonding member is disposed on the second surface, utilizing the height difference to create enhanced bonding geometry. This dimensional change from a flat surface to a stepped surface improves bonding strength by increasing the effective bonding area and creating mechanical interlocking effects.
Solution Approach 2:
A bonding member is introduced as an intermediary element between the external connecting terminal of the light emitting device and the land pattern. The bonding member facilitates reliable electrical and mechanical connection, mediating the interface between the device terminal and the substrate land pattern to achieve sufficient bonding strength.
2Strength
If a bonding member is disposed on a stepped land surface, then bonding strength is enhanced, but manufacturing complexity increases
Solution Approach 1:
The land pattern is segmented into distinct height levels with a first surface and a second surface. This segmentation creates functional zones where the second surface at a different height provides optimal bonding geometry. The stepped structure divides the land into manageable surfaces that can be independently optimized for their specific functions.
Data Source
AI summary
A semiconductor device includes a mounting substrate with a land having a first surface and a second surface higher than the first surface, a side-emission type light emitting device including an external connecting terminal disposed on the first surface, and a bonding member disposed at least on the second surface to bond the external connecting terminal and the land.