Semiconductor Laser Base Structure for Compact Wire Bonding
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Solution Overview
Problem
Existing light emitting devices face challenges in facilitating wire bonding between light emitting elements and electronic members due to the complexity of their structural configurations, which hinders efficient electrical connections.
Innovation Solution
The design incorporates a base with stepped portions of different heights, allowing for separate wiring regions on each stepped portion, enabling easier wire bonding by positioning the bonding locations for semiconductor laser elements on the lower first stepped portion and the electronic member on the higher second stepped portion, thereby simplifying the connection process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a complex structural configuration is used for light emitting devices, then the device functionality is improved, but wire bonding becomes difficult
Solution Approach 1:
The base is divided into multiple stepped portions at different heights, with each stepped portion providing a separate wiring region. This segmentation allows wires to be bonded at different elevations, simplifying the wire bonding process while maintaining the device's functional complexity through separate wiring zones for different components.
2Volume of moving object
If multiple components are integrated in a compact arrangement, then device miniaturization is achieved, but wire bonding accessibility is reduced
Solution Approach 1:
The base incorporates stepped portions at different heights, utilizing the vertical dimension to create multiple wiring regions. This vertical stratification allows wires to access different bonding locations at varying elevations, improving accessibility for wire bonding while maintaining a compact horizontal footprint and achieving device miniaturization.
Data Source
AI summary
A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion facing the first stepped portion; a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion; a first wiring region located on the first stepped portion; and one or more first wires, each having a first end that is connected to the first wiring region. At least one of the one or more first wires is electrically connected to the first semiconductor laser element.