Stepped Diode Laser Module With Integrated Ceramic Cooling Channels
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Solution Overview
Problem
Existing multi-emitter laser modules lack an effective integrated cooling architecture for stepped platforms, which is essential for efficient heat dissipation and optical stacking, as previous approaches do not adequately address the cooling needs of such configurations.
Innovation Solution
A multi-emitter laser module with a single unitary ceramic base featuring stepped platforms, integrated cooling channels, and a metallization layer for efficient heat dissipation, where cooling fluid flows through internal channels to distribute heat effectively across the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple laser sources are assembled in a module with stepped platforms for optical stacking, then the combined optical output power is significantly increased, but heat dissipation becomes inadequate and thermal interference occurs between laser sources
Solution Approach 1:
The cooling system is segmented into multiple independent cooling channels, with each channel dedicated to cooling a specific laser source. This segmentation allows each laser source to be cooled independently, preventing thermal interference between adjacent sources while maintaining high combined optical output power.
Solution Approach 2:
Each cooling channel is positioned locally beneath its corresponding laser source on the stepped platforms. The cooling structure provides localized heat dissipation exactly where heat is generated, ensuring optimal thermal management for each laser source without affecting others.
2Temperature
If cooling channels are added to each platform to improve heat dissipation, then thermal management is enhanced, but the device complexity and component count increase
Solution Approach 1:
The cooling channels are merged into the stepped platform structure itself, making the platforms serve dual functions: optical stacking support and heat dissipation. This integration eliminates the need for separate cooling components, reducing overall device complexity while maintaining effective thermal management.
Solution Approach 2:
The stepped platforms are designed with multi-functionality, serving both as mechanical supports for optical stacking and as integrated cooling structures. Each platform simultaneously performs its structural role and heat dissipation role, reducing the total component count.
3Manufacturing precision
If a unitary ceramic base with integrated cooling channels is used, then manufacturing precision and thermal management are improved, but the ease of manufacture decreases
Solution Approach 1:
A ceramic material is used for the unitary base structure, combining optical precision, thermal conductivity, and mechanical stability in a single material. The ceramic enables both high manufacturing precision for platform alignment and effective heat dissipation, despite the increased manufacturing complexity.
4Temperature
If cooling fluid is distributed through internal channels in each platform, then heat dissipation efficiency is maximized, but the device complexity increases
Solution Approach 1:
The cooling channels are positioned in the vertical dimension beneath each laser source on the stepped platforms. This three-dimensional arrangement allows efficient heat dissipation from multiple sources simultaneously without requiring complex lateral routing, simplifying the overall cooling channel configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation and optical stacking, improving power density and reliability by maintaining low component counts and preventing thermal interference between laser sources.
Implementation Method 1
cooling fluid flows through internal channels to distribute heat effectively across the module
Implementation Method 2
providing a forced cooling by providing a flowing cooling medium through the carriers that support the laser sources
Data Source
Figure 1~2
Figure 3~5
Figure 6
AI summary
A laser module has a unitary base including stepped platforms with an offset relative to an adjacent platform, each stepped platform accommodating a laser source with at least a first and a second plurality of stepped platforms, each platform accommodating a cooling channel inside at a predetermined depth below the top surface of the platform to conduct a flow of cooling fluid provided on an inlet, the cooling channel running under a platform having microchannels, the cooling channels being connected to a fluid inlet with an inlet manifold that provides cooling fluid at the inlet and an outlet manifold to dispose the cooling fluid with waste heat at an outlet, the laser module producing in one embodiment no less than 100 Watt of optical power.