Stepped Semiconductor Laser Mounting for Compact Hermetic Sealing
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Solution Overview
Problem
There is a demand for a semiconductor laser device that can reduce the volume of space required for sealing multiple semiconductor laser elements.
Innovation Solution
A semiconductor laser device is designed with a support base having mounting surfaces that decrease in height stepwise, where semiconductor laser elements and collimator lenses are secured, and a sealing cover that surrounds them, allowing for hermetic sealing while minimizing space, facilitating easy optical axis alignment and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If multiple semiconductor laser elements are sealed in a conventional flat mounting configuration, then hermetic sealing can be achieved, but the volume of the sealing space becomes large
Solution Approach 1:
The patent transforms the conventional flat two-dimensional mounting arrangement into a three-dimensional stepped configuration. Mounting surfaces are arranged at different heights along the first direction, allowing laser elements to be positioned vertically staggered. This dimensional transformation reduces the horizontal footprint and sealing space volume while maintaining proper spacing and hermetic sealing capability.
Solution Approach 2:
The mounting surface is segmented into multiple stepped levels, with each level accommodating specific laser elements. This segmentation allows optimized positioning of each element at its appropriate height, reducing overall sealing volume while maintaining individual element accessibility and sealing integrity.
2Measurement precision
If semiconductor laser elements are mounted on flat mounting surfaces, then assembly is simple, but optical axis alignment between elements and collimator lenses becomes difficult
Solution Approach 1:
By introducing vertical height variation through stepped mounting surfaces, the patent enables precise optical axis alignment in the vertical dimension while maintaining horizontal positioning. Each mounting surface height can be specifically designed to position the laser element's optical axis at the correct vertical level relative to its collimator lens, achieving high alignment precision without complex adjustment mechanisms.
Solution Approach 2:
The mounting surfaces are pre-configured with specific stepped heights during manufacturing, establishing the correct optical axis positions before final assembly. This preliminary positioning action eliminates the need for complex post-assembly alignment adjustments, reducing device complexity while maintaining high alignment precision.
3Volume of stationary object
If multiple semiconductor laser elements are arranged in close proximity, then space efficiency improves, but optical interference between elements increases
Solution Approach 1:
The stepped mounting configuration utilizes the vertical dimension to separate laser elements that would otherwise be horizontally adjacent. By positioning elements at different heights, the patent maintains close horizontal spacing for space efficiency while the vertical offset prevents optical beam interference, effectively eliminating the harmful interaction.
Solution Approach 2:
The asymmetric stepped arrangement creates non-uniform vertical spacing between elements, which disrupts potential symmetric optical interference patterns. This asymmetric positioning ensures that optical paths do not cross or interfere while maintaining compact overall dimensions.
Data Source
AI summary
A semiconductor laser device includes: a support base having a plurality of mounting surfaces arranged in a first direction, wherein heights of the mounting surfaces from a reference plane that is parallel to the first direction decrease stepwise or gradually along the first direction; a first semiconductor laser element secured to a first mounting surface; a second semiconductor laser element secured to a second mounting surface; a first slow-axis collimator lens secured to the first mounting surface, the first slow-axis collimator lens being located at a position at which the first laser light is incident; a second slow-axis collimator lens directly or indirectly secured to the second mounting surface, the second slow-axis collimator lens being located at a position at which the second laser light is incident; and a first sealing cover that defines an inner space in which the first and second semiconductor laser elements are held.