Stepped Mesh Wick Structure for Vapor Chamber Fluid Return
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Solution Overview
Problem
Conventional vapor chamber designs face issues with working fluid flow-back disconnection due to different sintering shrinkage ratios of mesh plates and copper powder, affecting heat dissipation performance.
Innovation Solution
A stepped mesh-stacked powder-filling structure is introduced, forming a stepped accommodation space by stacking mesh plates and sintering metal powder into a porous wick structure, ensuring good fluid communication through horizontal overlapping surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mesh plates and sintered copper powder are combined in a conventional vapor chamber, then the wick structure can be formed, but disconnection occurs at the vertical interface due to different shrinkage ratios during sintering
Solution Approach 1:
The patent transitions from a conventional planar interface to a three-dimensional stepped interface by stacking mesh plates at different heights. This dimensional change creates overlapping surfaces that provide multiple contact paths between the mesh plates and sintered copper powder, eliminating disconnection issues caused by shrinkage ratio differences.
Solution Approach 2:
The patent implements a nested structure where smaller mesh plates are positioned within the openings of larger mesh plates, creating a hierarchical arrangement. This nesting ensures intimate contact between the mesh plates and sintered copper powder throughout the structure, maintaining connection reliability despite differential shrinkage during sintering.
2Reliability
If the wick structure is designed to accommodate different shrinkage ratios, then connection reliability improves, but the working fluid flow-back capability deteriorates
Solution Approach 1:
The patent applies different mesh plate configurations to different regions of the vapor chamber. The stepped structure creates zones with varying porosity and capillary characteristics, allowing the wick structure to simultaneously maintain reliable connections and provide efficient fluid flow-back paths through locally optimized properties.
Solution Approach 2:
By creating a three-dimensional stepped structure with overlapping surfaces, the patent adds vertical flow paths in addition to horizontal paths. This multi-directional fluid transport capability ensures that working fluid can bypass connection interfaces and maintain efficient flow-back capability while connection reliability is improved through the stepped accommodation space.
3Manufacturing precision
If mesh plates are stacked to form a stepped structure, then the accommodation space for copper powder is optimized, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the wick structure into multiple discrete mesh plate segments stacked in a stepped arrangement. Each segment can be manufactured and prepared separately, then assembled through the sintering process. This segmentation allows for precise control of the accommodation space while managing manufacturing complexity through modular construction.
Solution Approach 2:
The patent combines multiple mesh plates and copper powder layers into a single integrated stepped structure through the sintering process. While the assembly process is complex, the final sintered product merges all components into one monolithic structure, eliminating the need for separate assembly steps and reducing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation capabilities and improves the back-flow efficiency of the working fluid, resulting in improved overall vapor chamber performance.
Implementation Method 1
After the metal powder such as the copper powder is filled in the stepped accommodation space, it can be sintered into a porous wick structure
Implementation Method 2
the mesh plates in the vapor chamber can smoothly guide the working fluid to flow back to the wick structure
Data Source
AI summary
A stepped mesh-stacked powder-filling structure is disclosed and includes a cover plate, a first mesh plate, a second mesh plate and a wick structure. The first mesh plate is stacked on an inner surface of the cover plate along a first direction, and includes a first through opening. The second mesh plate is stacked on the first mesh plate along the first direction and includes a second through opening in communication with the inner surface through the first through opening. The second through opening is greater than the first through opening in view of the first direction, and a top surface of the first mesh plate not covered by the second mesh plate forms a first overlapping surface. The wick structure is disposed in the first and second through openings, and connected to the first mesh plate through the first overlapping surface.