Stepped Metal Sensing Structures for Analyte Detection

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Solution Overview

Problem

Existing sensing structures, such as surface plasmon resonance structures, have insufficient sensitivity for analyte detection.

Innovation Solution

A sensing structure with a substrate and a metal layer featuring a first portion on the substrate and a second portion in a recess, with a gap between them ranging from 20 nm to 100 nm, and a sensing chip comprising a filter array, carrier layer, light-blocking layer, and polarizer, formed through anisotropic etching processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional sensing structures are used, then the structure is simple and easy to manufacture, but the sensitivity for analyte detection is insufficient

Engineering Contradiction:
ImprovesensitivityVSAvoidstructure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The metal layer is segmented into multiple portions (first portion, second portion, third portion) at different heights above the substrate, creating a stepped configuration. This segmentation allows each portion to interact with light differently, enhancing the sensing capability while maintaining a manufacturable structure through selective etching processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention introduces vertical dimensionality by creating portions of the metal layer at different heights (z-direction) rather than just in the planar direction. The first portion extends highest, the second portion is intermediate, and the third portion is lowest, creating a three-dimensional stepped structure that enhances light-matter interaction for improved sensitivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If the metal layer is made thicker to improve detection, then the sensitivity increases, but the manufacturing precision becomes more difficult to control

Engineering Contradiction:
Improvedetection capabilityVSAvoidgap control
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

A mask layer is formed beforehand on the substrate before depositing the metal layer. This pre-formed mask serves as a template that guides the subsequent metal deposition and etching processes, ensuring that the metal portions are deposited in the correct locations and heights, thereby facilitating precise gap formation without requiring extreme manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention controls the gap dimension (20-100 nm) by adjusting deposition parameters and etching conditions rather than relying solely on mechanical precision. By changing the physical parameters of the fabrication process (deposition thickness, etch selectivity, mask thickness), the gap size is precisely controlled to optimize sensing performance while remaining manufacturable.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structured sensing chip enhances sensitivity by improving the detection of wavelength shifts, allowing for more precise analyte detection.

Implementation Method 1

Sensing structures such as surface plasmon resonance (SPR) structures are widely used to sense and detect analytes

Methodology Applied
Scientific EffectSurface plasmon resonance:

Data Source

PatentUS20250291097A1Sensing structure, sensing chip including the same, and method for forming the same
Publication Date: 2025.09.18 VISERA TECH CO LTD
  • US20250291097A1 patent drawing
  • US20250291097A1 patent drawing
  • US20250291097A1 patent drawing

AI summary

A sensing structure, a sensing chip including the sensing structure, and method for forming the sensing structure are provided. The sensing structure includes a substrate and a metal layer. The substrate has a first recess. The metal layer is disposed on the substrate. The metal layer includes a first portion and a second portion. The first portion is disposed on a top surface of the substrate. The second portion is disposed in the first recess. The second portion includes a base portion and a protruding portion disposed on the base portion and extending away from the substrate. A gap is between the first portion and the protruding portion and surrounds the protruding portion, and the gap is in a range of 20 nm to 100 nm.