Stepped Semiconductor Package Layout for Thin Antenna Integration
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving smaller, faster, and higher-performance electronics with improved space utilization and reduced thickness, particularly in integrating semiconductor systems and antennas into a single package effectively.
Innovation Solution
A semiconductor package design featuring a package substrate with a first and second conductive pattern of different thicknesses, an encapsulant layer with a cavity region for a connector assembly, and a partial shielding layer, allowing for compact integration of electronic components and antennas without increasing the package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a traditional semiconductor package structure is used, then the package can be manufactured with standard processes, but the space utilization is poor and the thickness is large
Solution Approach 1:
The package substrate is divided into a first portion with first thickness and a second portion with second thickness, creating a stepped structure that improves space utilization. The substrate is segmented into different functional regions with different thicknesses to accommodate various components efficiently.
Solution Approach 2:
The invention transitions from a uniform two-dimensional substrate to a three-dimensional stepped structure by varying the thickness in the vertical dimension. This creates multiple levels (first and second portions) that allow better spatial arrangement of components.
2Length of stationary object
If the package thickness is reduced, then smaller and more compact devices are achieved, but the integration of connectors and shielding becomes more difficult
Solution Approach 1:
The connector assembly is pre-integrated into the encapsulant layer before final packaging, and the shielding layer is pre-formed on the encapsulant. These preliminary actions simplify the overall manufacturing process despite the reduced thickness, as components are prepared and positioned in advance.
Solution Approach 2:
The connector assembly is nested within the encapsulant layer, which itself is formed on the package substrate. The shielding layer is nested on the encapsulant. This nested arrangement allows multiple components to be integrated in a compact manner within the reduced thickness.
3Adaptability or versatility
If more electronic components are integrated into the package, then higher functionality and performance are achieved, but the package size and thickness increase
Solution Approach 1:
By utilizing the vertical dimension with the stepped substrate structure (first and second portions of different thicknesses), the package can accommodate more components without increasing the horizontal footprint. The third-dimensional space is exploited to improve functionality while maintaining compactness.
Solution Approach 2:
The flexible encapsulant layer can be formed with a cavity region that adapts to accommodate the connector assembly and other components. This dynamic formation process allows the encapsulant to conform to the integrated components, enabling higher functionality without rigid structural constraints that would increase thickness.
4Object-affected harmful factors
If a full shielding layer is formed on the entire encapsulant, then electromagnetic interference protection is improved, but the manufacturing complexity and cost increase
Solution Approach 1:
Instead of applying shielding uniformly across the entire encapsulant, the shielding layer is applied locally only to specific regions where electromagnetic interference protection is most needed. This local quality approach maintains EMI protection effectiveness while reducing manufacturing complexity and material usage.
Solution Approach 2:
The invention applies partial shielding rather than complete shielding. By providing shielding only in critical areas (partial action), the manufacturing process is simplified and costs are reduced while still achieving adequate electromagnetic interference protection for the essential components.
Data Source
AI summary
A semiconductor package comprises: a package substrate comprising: a first portion comprising a first conductive pattern extending therewithin having a first thickness; and a second portion comprising a second conductive pattern extending therewithin having a second thickness smaller than the first thickness; at least one electronic component mounted on the second portion and electrically coupled to the second conductive pattern; an encapsulant layer formed on the second portion of the package substrate and covering the at least one electronic component, wherein the encapsulant layer comprises a cavity region; a connector assembly formed within the cavity region of the encapsulant layer and electrically coupled to the second conductive pattern, wherein the connector assembly is exposed from the encapsulant layer to allow for electrical connection with an external device; and a partial shielding layer formed on at least regions other than the cavity region of the encapsulant layer.